5610 Gold ball wire bonder / Pull & Shear tester

Manufacturer: F&S BONDTEC Semiconductor GmbH
Semi-automatic gold-ball wirebonder with pull & shear heads.

Specifications:
Mechanics X, Y table
Working area 100 x 115 mm
Resolution 0.25 μm, repeatability < 2 μm
Z-axis 60 mm
Speed up to 20 wires / min.

Bond head
Gold Ball-Wedge
Negative flame-off unit
F & K 67 kHz US standard, 120 kHz or 140 kHz optional
Wire diameter 17.5 ... 50 μm

Control
OS: Windows XP

Heated work holder
Standard 4x4“ (200°C)
(optional: Ø 80mm and up to 250°C)

Head Parking System
For storing of temporary not required bondhead or pull- and shear-heads.
Can be mounted on the left or right side of the machine

Camera
With cross hair targeting for positioning of bonds

Microscope
Stereoskop Standard 40x

Lighting
20 W halogen spot light and LED direct light

Dimensions
Height 70 cm, width 70 cm, depth 65 cm; approx. 70 kg

Supplies
100...240 VAC, single-phase, 50/60 Hz, max. 500 VA

Connections
Air 6 bar; vacuum 0,7 bar

Extra
Pull head PH-0100
Shear head SH-5000

Condition: Used, in good working condition.