ADE UltraScan 9300, Wafer Inspection System

Brand: ADE
Model: UltraScan 9300
WAFER INSPECTION SYSTEM

Specifications
• Used
• 2 cassette input stations
• 3 cassette output stations
• Pre-aligner station, low resist station, flatness station
• Dual end effector robot
• 9300 power supply
• 350 arm controller
• Unix computer and drive
• ASC II
• Teal power conditioner
• Printer
• Non-contact capacitive probe measurement
• 10nm resolution
• 400 to 1000 microns wafer thickness range
• Capable of handling 100mm to 200mm wafers.
• Capable of measuring: lapped, ethced, polished, and patterned wafers
• Measures bow and warp, site and global flatness, thickness