Finetech FINEPLACER LAMBDA Sub-Micron Die bonder
Ref :
2802318-9-A
Condition :
Used
Manufacturer :
Finetech
Model :
FINEPLACER LAMBDA
Short Description :
Sub-Micron Die bonder
Year(s) :
2017
Quantity :
1
Location :
Seller or machines location:
AMERICA North (USA-Canada-Mexico)
AMERICA North (USA-Canada-Mexico)
Includes:
FINEPLACER lambda
Bonding force module FD3
Chip heating module
Optional Dispensing Module FG3
WinFlipChip software version 3.2 Revision 052 and PC
Option: Substrate heater 50mm x 50mm or 50mm x 100mm- Inquire
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