Finetech PICO Multi purpose bonder & High Density Rework station

Multi-purpose Die Bonder The FINEPLACER® pico ma
is a cost effective bonder designed for prototyping or
low-volume production, R&D labs and universities.
Finetech PICO configured for bonding optical lens
assemblies used in LIDAR This versatile platform is
used in a wide range of micro assembly applications –
such as flip chip bonding, die attach and
components requiring a novel bonding approach.
Highlights - Placement accuracy 5 μm
- Components from 0.125 mm x 0.125 mm to 100 mm x 100 mm
- Working area up to 450 mm x 234 mm
- Motorized Z axis placement
- Supports wafer/substrate sizes up to 200 mm
- Supports bonding forces up to 700 N

Manufacture date June 2021. Original cost over 120k
configuration:
PICO base system with manual zoom camera and USB and LED illumination
Integration of 2nd vaccum circuit
Optics shifting 85mm, crank handled
Target finder
LED coaxial illumination for chip and substrate
Placement arm including theta rotation
Adjustment set, 5um for placement arm with fine rotation
WinFlipChip software and PC
Y-camera shifting
Process video module
Height adjustable tracks for positioning table
Bonding force module, automatic
UV curing option for FINEPLACER lambda, pico, micro
Placement head with gimbal for chip 18.2x16.6x0.95
Eccentric tool holder
Vacuum plate 220x120 with holder for tray and UV station
Micron adjustable arm stop in lower arm position
Full manual included