KLA-Tencor CS20

[ General Description ]
Wafer Size : 2 ~8 inch
Illumination Source : 8mW laser, 635 nm wavelength
Operator Interface : Trackball and keyboard standard
Substrate Thickness : 350 μm ~ 1,100 μm
Substrate Material : Any clear or opaque polished surface


[ Performance ]
Defect Sensitivity 0.08 μm diameter PSL sphere equivalent > 95% capture rate(PSL on bare Si)
Other Defects and Applications : Particles, scratches, stains, pits, and bumps.
Sensitivity: Minimum detectable size for automatic defect classification:
- Scratches: 100 μm long, 0.1 μm wide, 50 Å; deep.
- Pits: 20 μm diameter, 50 Å; deep
- Stains: 20 μm diameter, 10 Å; thick

[ Application ]
- Opaque substrates
- EPI Layers
- Transparent film coatings (SiC, GaN, Sapphire)