LAM 2300 3 Chambers Etch System

Installed.
Unused Since Installation/Qualification
It’s in Working Condition.
Process Capabilities : Dielectric Etch/Metal Etch/Microwave Strip
Wafer : Set Up for 200 mm (Maximum 300 mm)
Vintage : 2023
CE Mark
All Pumps, Generators & Other Subsystems Included

Chambers are :
2300 Platform V2 Etch Transfer Module
3ea 200mm Open Cassette Loadports
Front & Side User Interface Monitors
CDM Wafer Handling Robot

2300 Exelan Flex45 Dielectric Etch Process Module
OES 2 End Point Detection
Low Temperature ESC
Boce 2700 LPM Turbo Pump
16 Regulated Gas Channels

Versys HP Metal Etch Process Module
OES 2 End Point Detection
Boce 2200 LPM Turbo Pump
16 Regulated Gas Channels

Microwave Stripper Process Module
On Board Gas System
3 Regulated Gas Channels