Plasmatherm SLR 770

Plasmatherm SLR-770 ICP Shuttle Lock Inductively Coupled Plasma Etch System.
Configured for etching of metals and compound semiconductors
Previous usage was deep etching of GaAs with chlorine chemistry PC controller.
Vacuum load lock with wafer transfer robot.
Can process wafers from 2” to 8” depending on which process kit is installed.
Currently configured with 4” kit. Helium backside cooling of substrate in
conjunction with computer controlled substrate clamping.
High frequency RF-based inductively coupled plasma source capable of
high density plasma generation.
Closed loop pressure control.
Turbo pump with roughing pump.
Total of six MFC gas controllers.
Previous gases used N2, O2, He, CHF3, Cl2, BCL3
Includes Thermo Neslab water chiller