Used Semiconductor and PCB Manufacturing
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Vintage: 12/2018 Benchtop 3D Automated Optical Inspection System Direct Loading Max PCB Size: 520mm Orca Chas Year(s) : 2018 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsPick and Place Windows 7 Professional Operating System Dual Placement Heads Placement Rate (IPC-9850): 5,500 C Year(s) : 2014 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsFIFO BUFFER SMEMA Compliant Volts: 110 Phase: 1 Amps:<15 Hertz: 60 PSI: 4-6 bar Board Flow Direction: LTR Skid Year(s) : 2008 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsFilm developer Brand: Colenta max film width 1100mm temperatures FIX and DEV adjustable from 18 to 43 degr.C. Year(s) : 2019 Location : EUROPE (Western and Northern)
Price : On request
More detailsCylinder cabinet (NH3,NH3) Year(s) : 1993 Location : ASIA (North East)
Price : On request
More detailsDouble sided double glass/ mylar draws exposure, water cooled 7kW. Year(s) : 1994 Location : EUROPE (Western and Northern)
Price : On request
More detailsTaping machine Year(s) : 1994 Location : ASIA (North East)
Price : On request
More detailsTape peeling machine Year(s) : 1998 Location : ASIA (North East)
Price : On request
More detailsDry etching system (SiO2) Year(s) : 2011 Location : ASIA (North East)
Price : On request
More detailsDiffusion furnace (OX) Year(s) : 2000 Location : ASIA (North East)
Price : On request
More detailsDiffusion furnace (SOG bake) Year(s) : 1994 Location : ASIA (North East)
Price : On request
More detailsFume hood Year(s) : 1989 Location : ASIA (North East)
Price : On request
More detailsWafer Size 4 Year(s) : 2012 Location : ASIA (North East)
Price : On request
More detailsDICING SAW WITH SPLIT FIELD MICROSCOPE 6″ CAPABILITY Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsWAFER BONDER, BONDS RUBBER DISC TO WAFERS UP TO 6″ PRIOR TO DICING, SCRIBING Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsBT 175 BUBBLE TESTER Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsGOLD TIN REFLOW SYSTEM Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsMaximum Board Size: 18” x 22” (458mm x 560mm) Minimum Component Size: 0.010” (0.25mm) 1.6 kW Focused Convectio Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsSPECS: I.D. 40"W X 40"D X 36"H O.D. 71"W X 54"D X 94"H Temperature Range: -70 to +170 Deg. C - LN2 Cooled Watl Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsSPECS: I.D. 16"W X 11"D X 12"H O.D. 22"W X 26"D X 61"H Temperature Range: -75 to +200 Deg. C - Air Cooled Has Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsNordson select cure uv conformal coat curing oven with 6 inch cure width. Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsLaboratory ovens, fresh-air with explosion protect Location : EUROPE (Western and Northern)
Price : On request
More detailseS32 e-beam wafer inspection 200mm Condition Fair Serial Number(s) 2032 Year(s) : 2006 Location : EUROPE (Western and Northern)
Price : On request
More detailsSerial #: E2000-870241 SMEMA Compliant Volts: 110v Phase: 1 Amps: 8 Hertz: 60 Board Flow Direction: Left to Ri Year(s) : 2012 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsDeep access vertical feed wedge bonder (bonds gold wire, gold ribbon or aluminum wire)20220610 152426 Includes Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsUsed Semiconductor and PCB Manufacturing for sale
You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).
Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.
Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.
This industry is largely located in Asia and expecially in China.
The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES)
The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14