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Used Semiconductor and PCB Manufacturing

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Vintage : JAN 2016 Left to Right Board Flow 21" Max Board Width Year(s) : 2016 Location : AMERICA North (USA-Canada-Mexico)

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Temperature Chamber Model T6C Internal Chamber Dimensions: 20"W X 21"D X 23"H External Dimensions: 44"W X 45"D Location : AMERICA North (USA-Canada-Mexico)

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Temperature Chamber Model 926-1-2-0-0 - Bench Top Internal Chamber Dimension: 20-(wide) x 14-(deep) x 11-(high Location : AMERICA North (USA-Canada-Mexico)

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Brand GHI Dimensions: 42" X 22" X 21" Unit is on a 6" Table; 1.25" Thick Plate 100 to 120 Dry Filtered Air So Location : AMERICA North (USA-Canada-Mexico)

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MOTORIZED OBJECTIVE TURRET 10, 20, 50X PLAN OBJECTIVES BRIGHT/DARK FIELD 100 WATT ILLUMINATION SOURCE 6X6″ TRA Location : AMERICA North (USA-Canada-Mexico)

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DOUBLE SIDED MASK ALIGNER DUAL 7” DIAMETER LIGHT SOURCES, 200 WATTS XY THETA MOVEMENT OF BOTTOM MASK AND SUBST Location : AMERICA North (USA-Canada-Mexico)

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MASK ALIGNER (HYBRID TECHNOLOGY GROUP) 7” DIAMETER BEAM. NEW TOUCH SCREEN CONTROLS REBUILT WITH 1 YEAR WARRANT Location : AMERICA North (USA-Canada-Mexico)

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Manual wafer load profilometer Max wafer size: 8"/200mm Computer controlled Measures roughness, waviness, step Location : AMERICA North (USA-Canada-Mexico)

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OEM: Lotus Configuration: Oxide (2 tanks, spin rinse dryer) Wafer 150mm Available: Q1 Year(s) : 2018 Location : EUROPE (Western and Northern)

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WAFER SIZE 300mm Year(s) : 2009 Location : EUROPE (Western and Northern)

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High K Metal CVD and ALD system, NiOx, HfOx process Version: 300 MM Vintage: 01.06.2012 Tokyo Electron Tria Year(s) : 2012 Location : AMERICA North (USA-Canada-Mexico)

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EFEM Unit Only Version: 300 mm Vintage: 01.07.2006 DEINSTALLED AND WAREHOUSED CAN BE INSPECTED BY APPOINTMEN Year(s) : 2006 Location : AMERICA North (USA-Canada-Mexico)

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Version: 300 mm As lithography requirements shrink linewidths, wafer nanotopographybecomes critical todevice Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Minimum 50 mm Maximum 200 mm Set Size 150 mm Process Chlorine Etch Loadlock Loadloc Year(s) : 2003 Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Minimum 50 mm Maximum 200 mm Set Size 150 mm Process Silicon Etch Bosch Process Loadlo Location : AMERICA North (USA-Canada-Mexico)

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Maximum 100 mm Process Plasma etch Controller Type Microprocessor Controller Type End Point Detection Yes Location : AMERICA North (USA-Canada-Mexico)

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Internal Chamber Dimensions: 31"W X 17"D X 26"H External Dimensions: 54"W X 49"D X 84"H Temperature Range: -30 Location : AMERICA North (USA-Canada-Mexico)

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Internal Chamber Dimensions: 12"W X 22"D X 20"H External Dimensions: 20"W X 51"D X 39"H Temperature Range: -10 Location : AMERICA North (USA-Canada-Mexico)

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CSZ Temperature Chamber Model CT-18-2-2-H/AC Internal Chamber Dimensions: 31"W X 32"D X 32"H Temperature Range Location : AMERICA North (USA-Canada-Mexico)

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Expose up to 4” wafers 350 lamp with digital power supply. Upgraded with new PLC/HMI Touch screen controls. Hi Location : AMERICA North (USA-Canada-Mexico)

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FILM AND HYBRID APPLICATIONS. WAFERS UP TO 4.5″X5″ AREA. Location : AMERICA North (USA-Canada-Mexico)

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1000 WATT POWER SUPPLY 1 MICRON RESOLUTION ON 6″ WAFERS IR BACK SIDE ILLUMINATION SPLIT FIELD MICROSCOPE WITH Location : AMERICA North (USA-Canada-Mexico)

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( TEMPRESS SCRIBER COMPLETELY REBUILT BY LOOMIS) INCLUDES WAFER BREAKER OPTION Location : AMERICA North (USA-Canada-Mexico)

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1006A WITH VIDEO CAMERA AND MONITOR, 6″ CAPABILTY, AIR BEARING SPINDLE SERVICED BY FACTORY TRAINED TECHNICIAN. Location : AMERICA North (USA-Canada-Mexico)

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Version: 300 mm Vintage: 01.05.2009 -Sold including a demo showing the probers in working condition. -Inspec Year(s) : 2009 Location : AMERICA North (USA-Canada-Mexico)

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Used Semiconductor and PCB Manufacturing for sale

You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).

Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.

Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.

This industry is largely located in Asia and expecially in China.

The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES) 

The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14

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