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Used Semiconductor and PCB Manufacturing

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- Automatic inline printer - Dimensions : 1008 x 1275 x 2081 mm (with beacon) - Weight : 500 Kg - Maximum boar Year(s) : 2007 Location : EUROPE (Western and Northern)

Price : On request

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Wafer Inspection Tool Year(s) : 2006 Location : United States (USA)

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Description: BOARD HANDLING Maximum Board Size (X x Y) 558 mm x 508 mm or (22” x 20”) Minimum Board Size (Y x Year(s) : 2014 Location : AMERICA North (USA-Canada-Mexico)

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- Chamber Dimensions 16” x 16” x 16” with fixed shelf - 8 Heaters (200 Watt Each) - Temperature Controller - H Location : AMERICA North (USA-Canada-Mexico)

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Heavy Wire Bonder Location : EUROPE (Western and Northern)

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- Dual Function (Prime / Reversal) - Up to 200 Degrees Celsius - Chamber Dimensions 16” x 16” x 16” - One She Location : AMERICA North (USA-Canada-Mexico)

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- Windows based with Suss AL 900 / Autoalign System - Alignment System MA200e TSA - PC -Aut. Adjustment ( Cog Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)

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Windows OS 6 Spindle Head Fixed Feeder Bank Min component size 0402 Max PCB size 20” x 18” Six Laser Flying Vi Year(s) : 2007 Location : AMERICA North (USA-Canada-Mexico)

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Inline or standalone Includes Two Fusion Lamps Chain Rail 20" Process Width Left to Right Flow 208-220V Operat Location : AMERICA North (USA-Canada-Mexico)

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709/703 hot gas bonder Includes: New touch screen with recipes Timed parameters: pre scrub, scrub and post sc Location : AMERICA North (USA-Canada-Mexico)

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20 bonder Location : AMERICA North (USA-Canada-Mexico)

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4020 Hot Gas Eutectic Bonder Single hot gas jet, tilting collet, joystick control with stereo zoom optics and Location : AMERICA North (USA-Canada-Mexico)

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double roll tacky roll cleaner, max panel width 650 mm Year(s) : 2008 Location : EUROPE (Western and Northern)

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4 dual head driller w/ linear X-Y-Z axis, WW 1686-12 spindles (180.000 Rpm), table size: (4x) 610 x 724 mm, op Year(s) : 2001 Location : EUROPE (Western and Northern)

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Description: Colour Digital Camera based system with x10 Digital Zoom Illumination via 8W fluorescent Year(s) : 2007 Location : EUROPE (Western and Northern)

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Production Hours: Single shift production Description: High resolution in-line automatic optical inspection So Year(s) : 2007 Location : EUROPE (Western and Northern)

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System is still running at the fab and will be de installed soon Location : ASIA (North East)

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Automatic Wedge Bonder Location : AMERICA North (USA-Canada-Mexico)

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Die Pick and Sort Tool Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size 5 Year(s) : 1985 Location : ASIA (North East)

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Wafer Size 5 Year(s) : 1989 Location : ASIA (North East)

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Wafer Size 5 Year(s) : 1990 Location : ASIA (North East)

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Wafer Size 5 Year(s) : 1983 Location : ASIA (North East)

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Maximum Temperature 240 ºC (464 ºF, 513 ºK) Heat/Cool Controls Control Type Analog Setpoint Overtemp Location : AMERICA North (USA-Canada-Mexico)

Price : On request

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as good as new! Year(s) : 2014 Location : EUROPE (Western and Northern)

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Used Semiconductor and PCB Manufacturing for sale

You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).

Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.

Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.

This industry is largely located in Asia and expecially in China.

The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES) 

The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14

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