Used Semiconductor and PCB Manufacturing
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Pick and Place SMT Machine Year(s) : 2019 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsManufacturer: Winson Automatic Equipment Limited Equipment Type: Bare Board Loader Minimum Width: 3” Maximum Year(s) : 2016 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsEquipment Type: FIFO - LIFO Buffer Minimum Width: 3” Maximum PCB Size: Width: 18” Length: 20” Belt Track Len Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsEquipment Type: FIFO - LIFO Buffer Minimum Width: 3” Maximum PCB Size: Width: 16” Length: 29.5”(one stage) 14. Year(s) : 2006 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsWest Bond Manual Wire Bonder Location : EUROPE (Western and Northern)
Price : On request
More detailsThis Mech-El MEI Marpet 1204B Manual Gold Ball Wire Bonder looks to be in good cosmetic condition, showing so Location : EUROPE (Western and Northern)
Price : On request
More detailsThis West-bond 7416A Manual Thermocompression Wedge Wire Bonder looks to be in good cosmetic condition, show Location : EUROPE (Western and Northern)
Price : On request
More detailsdry: ICP Etcher/380mm Location : ASIA (North East)
Price : On request
More detailsCVD Year(s) : 2008 Location : ASIA (North East)
Price : On request
More detailscvd: LPCVD/DPLOY Location : ASIA (North East)
Price : On request
More detailsWafer weighing system - Filmthickness Wafer Size Range Set Size 200 mm Accessories Wafer Scale (Mettle Year(s) : 2011 Location : EUROPE (Western and Northern)
Price : On request
More detailsWafer weighing system - Filmthickness Wafer Size Range Minimum 200 mm Maximum 300 mm Other Informatio Year(s) : 2017 Location : EUROPE (Western and Northern)
Price : On request
More detailsWafer weighing system - Filmthickness Wafer Size Range Set Size 200 mm Accessories Last Calibration of W Year(s) : 2015 Location : EUROPE (Western and Northern)
Price : On request
More details18" Max Board Width Model: EUS 01 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsVintage : JUL 2013 Right To Left Board Flow Holds Up to 15" Wide Magazines Voltate: 110-230VAC 1ph Year(s) : 2013 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsCVD: MOCVD Year(s) : 2010 Location : ASIA (North East)
Price : On request
More detailsVintage : SEP 1999 18" Max Board Wdith R-L Board Flow Omron CPM1 PLC Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsGrinder Heavy smoker DTU 150 Chiller DVC 010 Vacuum coolant unit Air supply source: Pressure: 0.5-0.8 MPa Location : ASIA (South East)
Price : On request
More detailsFlip Chip Bonder Model FCB3 Year(s) : 2011 Location : EUROPE (Western and Northern)
Price : On request
More detailsCan be set up for dotting or dispense epoxy Year(s) : 2019 Location : EUROPE (Western and Northern)
Price : On request
More detailsDie Bonder Model MCM-12 Year(s) : 2011 Location : EUROPE (Western and Northern)
Price : On request
More detailscoat: TRACK（1C3D) Location : ASIA (North East)
Price : On request
More detailsStepper Year(s) : 1999, 2000 Location : ASIA (North East)
Price : On request
More detailscvd: LPCVD/TEOS Location : ASIA (North East)
Price : On request
More detailsConfigured for Top Side & Bottom Side Alignment (TSA/BSA) EISS 2.0 Enhanced Image Storage System EISS 2.0 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsUsed Semiconductor and PCB Manufacturing for sale
You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).
Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.
Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.
This industry is largely located in Asia and expecially in China.
The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES)
The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14