Used Semiconductor and PCB Manufacturing
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ASM Wafer Die Sorter MS899-DL Model Number: MS899-DL Year: August 2008 Cycle Time: 175ms XY Placement: +/- 1. Year(s) : 2008 Location : EUROPE (Western and Northern)
Price : On request
More detailsFlip Chip Bonder Maker BESI Year(s) : 2022 Location : ASIA (North East)
Price : On request
More detailsFli: Micro bonder/8in Location : ASIA (North East)
Price : On request
More detailsFlip Chip Bonder Year(s) : 2007 Location : ASIA (North East)
Price : On request
More details2200 EVO (Gen1) Bonder Year(s) : 2011 Location : EUROPE (Western and Northern)
Price : On request
More details2200 EVO (Gen2) Bonder Year(s) : 2014 Location : EUROPE (Western and Northern)
Price : On request
More details2200 EVO+ Bonder Year(s) : 2019 Location : EUROPE (Western and Northern)
Price : On request
More detailsSoC Tester Location : ASIA (North East)
Price : On request
More details2200 EVO Bonder double cabin Year(s) : 2018 Location : EUROPE (Western and Northern)
Price : On request
More details• Software Version: v6.1.6.126 • Indexing Belting Type: 1 • Pump Head: DJ9500 • Laser Height Sensor: included Year(s) : 2016 Location : EUROPE (Western and Northern)
Price : On request
More detailsHandler：Test Handler Location : ASIA (North East)
Price : On request
More detailsEquipment according the age in good in good shape, however only one wafer stage is currently working 2003: "A Year(s) : 2003 Location : EUROPE (Western and Northern)
Price : On request
More detailsYESTECH Nordson YTV-FX 2014 Inline AOI, 5 Camera, Windows 7 - DOM: 4/2014 Year(s) : 2014 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsAgilent 3070 Series 3, In Circuit Tester - Configured as Series 5! 4 Mods with 2 mods loaded, (with Extern Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsElectrovert VectraES Dual Wave solder VCL-14978 11/2006 Bottom Preater config : Convection / Convection Top : Year(s) : 2006 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsAutomatic teaching of board mark and mask recognition marks Cycle time : . 8.0 s + printing time. Model # NM- Year(s) : 2007 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsElectroglas, Inc. 4090u Thin Wafer Probe Wafer size: 8in. As is Working prior to decommission. Voltage: 230 V Location : EUROPE (Western and Northern)
Price : On request
More detailsWafer Grinding, Lapping & Polishing As Is Vintage : 2012 It's a complete tool. Year(s) : 2012 Location : EUROPE (Western and Northern)
Price : On request
More detailsSACVD (Chemical Vapor Deposition) Deposition Equipment Equipment details: Date of Manufacture: 2006 Currently Year(s) : 2006 Location : EUROPE (Western and Northern)
Price : On request
More detailspac: AOI Year(s) : 2010 Location : ASIA (North East)
Price : On request
More detailsProber Year(s) : 1997 Location : ASIA (North East)
Price : On request
More detailsProber Location : ASIA (North East)
Price : On request
More detailsExterior Dimensions Width 16.000 in (40.6 cm) Depth 21.000 in (53.3 cm) Height 32.000 in (81.3 cm) Weight 108 Year(s) : 2006 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsWafer Size Range Minimum 50 mm Maximum 200 mm Process DRIE PECVD Controller Type PC Controller Type End Point Year(s) : 2001 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• Maximum Temperature: 1200 °C • Minimum Temperature: 21 °C • Temperature Control Stability: ±0.100 °C • Contr Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsUsed Semiconductor and PCB Manufacturing for sale
You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).
Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.
Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.
This industry is largely located in Asia and expecially in China.
The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES)
The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14