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Used Semiconductor and PCB Manufacturing

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Maximum Temperature 150 ºC (302 ºF, 423 ºK) Minimum Temperature 25 ºC (77 ºF, 298.00 ºK) Heat/Cool Contr Location : AMERICA North (USA-Canada-Mexico)

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Measuring Range: 100Å to 1310kÅ Scan Speed Range: Low, Medium, High Vertical Resolution: 1Å in the 65kÅ range, Location : AMERICA North (USA-Canada-Mexico)

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Measuring Range: 100Å to 1310kÅ Scan Speed Range: Low, Med, High Vertical Resolution: 1Å in the 65kÅ r Location : AMERICA North (USA-Canada-Mexico)

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Microscope Type Upright Microscope Configuration Brightfield, Darkfield & DIC Illumination Type Reflected L Location : AMERICA North (USA-Canada-Mexico)

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Microscope Configuration Brightfield, Darkfield & DIC Illumination Type Reflected & Transmitted Light Binocu Location : AMERICA North (USA-Canada-Mexico)

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Microscope Configuration Brightfield Illumination Type Reflected Light Binocular Angle Variable Eyepieces Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Minimum 50 mm Maximum 150 mm Set Size 150 mm Alignment Optics Splitfield Video So Location : AMERICA North (USA-Canada-Mexico)

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Model Periplan GF Magnification 10 X Field Number 18 mm Focusing YES Motorized Nosepiece YES Multip Location : AMERICA North (USA-Canada-Mexico)

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Description  Lapping Machine -- Single Sided Plate Diameter  12.00  in  (30.48 cm) Water Cooled Lap Plate  No Location : AMERICA North (USA-Canada-Mexico)

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Maximum Output Voltage 50.00 Volts Maximum Output Current 2.00 Amps Maximum Output Power 0.10 kW Regulation Location : AMERICA North (USA-Canada-Mexico)

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Maximum Temperature 350 ºC (662 ºF, 623 ºK) Heat/Cool Controls Control Type Digital Setpoint Overtem Location : AMERICA North (USA-Canada-Mexico)

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Precision Dip Coater Other Information Stroke / Dip range = up to 300 mm (12 inches) Tank size = 220L x 80W Location : AMERICA North (USA-Canada-Mexico)

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Output Voltage AC kV 5.00 kV AC Output Voltage DC kV 6.00 kV DC Other Information Voltmeter range: 0-1.2/ Location : AMERICA North (USA-Canada-Mexico)

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Applications X-ray equipment Ion implantation Cable testing TWT Helix supplies Multi-CRT Year(s) : 2001 Location : AMERICA North (USA-Canada-Mexico)

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Features C-V measurement for performing doping profile of wafers. C-V characterization and sorting of Location : AMERICA North (USA-Canada-Mexico)

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Microscope Type Microzoom Multiple Objectives Models Bausch and Lomb 2.25 X 0.04 N.A. 8 X 0.15 N.A. 25 X 0.3 Location : AMERICA North (USA-Canada-Mexico)

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Manual Ball Bonder Accessories Heated work holder B & L Stereozoom 4 Microscope Magnification: 7X to 30X Sp Location : AMERICA North (USA-Canada-Mexico)

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6 Channels,up to 200 programs, LCD Display Bonding area: 6" x 6" Throat dept: 5.6" Gross table motion: 5.5" Fi Location : AMERICA North (USA-Canada-Mexico)

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Description Analog Manual Wedge Bonder - Leica GZ6 Microscope Accessories Heated Clamp Work Holder Leica GZ6 Location : AMERICA North (USA-Canada-Mexico)

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Maximum Output Voltage 8.00 Volts Maximum Output Current 50.00 Amps Maximum Output Power 0.50 kW Panel Mete Location : AMERICA North (USA-Canada-Mexico)

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Features and Specifications: Resist Uniformity: 75 angstroms, 3 sigma Microprocessor Controlled (10 program c Year(s) : 1988 Location : AMERICA North (USA-Canada-Mexico)

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Condition Very Good Operating Air Pressure 80.00 PSI (551,624.00 N/sq m) Exterior Dimensions Width 35 Year(s) : 1985 Location : AMERICA North (USA-Canada-Mexico)

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Load: automatic cassette to cassette Beltless Elevator Cassette: Fluoroware 72 and 82 series Throu Location : AMERICA North (USA-Canada-Mexico)

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Mass Range 200 AMU Accessories CIS TS200 CIS Controller Part number 90B-140-G1 Leybold 151 Turb Location : AMERICA North (USA-Canada-Mexico)

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Description Wafer Backlapping Film Applicator -- 6" Other Information Set up for 6" wafers Power Requiremen Location : AMERICA North (USA-Canada-Mexico)

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Used Semiconductor and PCB Manufacturing for sale

You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).

Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.

Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.

This industry is largely located in Asia and expecially in China.

The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES) 

The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14

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