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Used Semiconductor and PCB Manufacturing

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Description: Other Information Wafer Size: 4 to 8" Tape Tension: Programmable Cycle Time: 30 seconds for a 6 Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)

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Power Requirements 208 V 20.0 A 50/60 Hz Exterior Dimensions Width 24.000 in (61.0 cm) Depth Location : AMERICA North (USA-Canada-Mexico)

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Vacuum System Cryo Pumped Load Lock Included No E Beam Power Supply Power Supply Type Solid State Hig Location : AMERICA North (USA-Canada-Mexico)

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Description High Volume Evaporator Vacuum System Cryo Pumped Load Lock Included No E Beam Power Supply Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Minimum 50 mm Maximum 100 mm Set Size 100 mm Other Information Chucks:2"-3"-4" Po Location : AMERICA North (USA-Canada-Mexico)

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Micro-syringe attachment: P/N 100-10-20 3-Axis spectrum stage Adjustable aperture lamp Illuminator Lamp power Location : AMERICA North (USA-Canada-Mexico)

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Vacuum System Cryo Pumped Load Lock Included Yes Number of RF Etch Cathodes 1 Substrate Heaters Yes Residu Location : AMERICA North (USA-Canada-Mexico)

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Manual Cleaning System -- Wafer, Photomask and Substrates Accessories Options Listed: 1-21993: Assy,Vacuum, Location : AMERICA North (USA-Canada-Mexico)

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ULTRA-CLEAN PRODUCTS SHOE CLEANER Location : AMERICA North (USA-Canada-Mexico)

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Description PECVD TEOS with Load Lock Wafer Size Range Maximum 200 mm Process PECVD & TEOS Controller T Year(s) : 2001 Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Maximum 200 mm Process PECVD/Plasma Etch/Reactive Ion Etch Controller Type Microproces Location : AMERICA North (USA-Canada-Mexico)

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Maximum Temperature 200 ºC (392 ºF, 473 ºK) Heat/Cool Controls Control Type Analog Setpoint Capacity/V Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Minimum 50 mm Maximum 200 mm Set Size 100 mm Mask Plate Size 5'' x 5'' Alignment Year(s) : 2001 Location : AMERICA North (USA-Canada-Mexico)

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Rated Power Output 1250 Watts Chamber Construction Aluminum Chamber Size Width 14.75 in (37.47 cm) Location : AMERICA North (USA-Canada-Mexico)

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8300 Weight 36 lb (16 kg) Location : AMERICA North (USA-Canada-Mexico)

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Maximum Temperature 316 ºC (601 ºF, 589 ºK) Heat/Cool Controls Control Type Analog Setpoint Overtemp Location : AMERICA North (USA-Canada-Mexico)

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Eutectic Die Attach System Location : AMERICA North (USA-Canada-Mexico)

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Etcher Type Planar - Magnetron Rated Power Output 4000 Watts Reactor Center Rectangular Reactor Center Size Location : AMERICA North (USA-Canada-Mexico)

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Xray Source Specifications X Ray tube: 47KV @ 1ma Mo anode Beam size: 1.5 Mill/40-45 Micron Resolution: 100 Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Minimum 50 mm Maximum 200 mm Set Size 150 mm Process Chlorine Etch Loadlock Loadloc Year(s) : 2003 Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Minimum 50 mm Maximum 200 mm Set Size 150 mm Process Silicon Etch Bosch Process Loadlo Location : AMERICA North (USA-Canada-Mexico)

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Maximum 100 mm Process Plasma etch Controller Type Microprocessor Controller Type End Point Detection Yes Location : AMERICA North (USA-Canada-Mexico)

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Maximum Temperature 300 ºC (572 ºF, 573 ºK) Heat/Cool Controls Control Type Programmable Overtempera Location : AMERICA North (USA-Canada-Mexico)

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Maximum Temperature 250 ºC (482 ºF, 523 ºK) Temperature Control Control Stability ± 2.000 ºC Heat/Cool Location : AMERICA North (USA-Canada-Mexico)

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Vacuum System None Vacuum System Chamber made up of the 8" CF 4-way cross, M/N: 600-4T, 304SS 8" CF Door/V Location : AMERICA North (USA-Canada-Mexico)

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Used Semiconductor and PCB Manufacturing for sale

You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).

Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.

Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.

This industry is largely located in Asia and expecially in China.

The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES) 

The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14

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