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Used Semiconductor and PCB Manufacturing

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Max Milling Area: 430 mm x 350 mm Max Panel Size: 430 mm x 350 mm PCB Thickness: .5mm to 3.2mm High speed line Year(s) : 2014 Location : AMERICA North (USA-Canada-Mexico)

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Hours: 3,000 4 Spindle Heads 200-240V Fixed Feeder Bank On the Fly Vision Minimum Board 2" x 2" Maximum Board Year(s) : 2012 Location : AMERICA North (USA-Canada-Mexico)

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Low Hours Running Hrs: 7457 MFU (x2) Left to Right 25,000 CPH Capable 01005 Capable Windows O/S Software and P Year(s) : 2015 Location : AMERICA North (USA-Canada-Mexico)

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Laser source Year(s) : 2012 Location : AMERICA North (USA-Canada-Mexico)

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Contact Profilometer Version: 150 mm Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)

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System configured for AsP use Version: 100 mm • E475 Stainless Steel High Efficiency Growth Chamber. Year(s) : 2010 Location : AMERICA North (USA-Canada-Mexico)

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Operational Status: Installed / Running Wafer Sizes: 4"/100mm Location : AMERICA North (USA-Canada-Mexico)

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ESEC Die Bonder Accessories Monitors Condition Good Year of Manufacture 2001 Year(s) : 2001 Location : EUROPE (Western and Northern)

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Plasma Etch Wafer Size Range Minimum 150 mm Maximum 150 mm Set Size 150 mm Other Information proc Year(s) : 1995 Location : EUROPE (Western and Northern)

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Motion Axes: 3 – No rotary head. No tilt adapters. Controller Axes: 4 Head Tooling: Double Z-slides: 2 Valves Year(s) : 2014 Location : AMERICA North (USA-Canada-Mexico)

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Chip Mounter Year(s) : 2006 Location : ASIA (North East)

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Screen Printer Maker AI MECHATEC Model HP-07 Year(s) : 2017 Location : ASIA (North East)

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Nitrogen Wave Soldering with pallet conveyor 2021 ERSA Nitrogen Wave Soldering System POWERFLOW ULTRA XL with Year(s) : 2020 Location : AMERICA North (USA-Canada-Mexico)

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Model: M360CHD Indexer assy config Horizontal CPU: G Location : EUROPE (Western and Northern)

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Wafer Inspection Microscope Model MIS200 Location : EUROPE (Western and Northern)

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VERTICAL FEED, HEATED WORK HOLDERS AND HEATED TRANSDUCER OPTIONS Location : AMERICA North (USA-Canada-Mexico)

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Measurement: Film thickness/Fluorescent X-ray Model XDVN-W Location : ASIA (North East)

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The aluminum or gold wire size it uses is .7-3 mil The weight of this machine is 60 lbs and the size is 12″ W Location : AMERICA North (USA-Canada-Mexico)

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manual wedge bonder Location : AMERICA North (USA-Canada-Mexico)

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MP200 double path tool non copper tool; double path tool delay stage; 6 inch chuck Cooling Water Required Min Year(s) : 2002 Location : EUROPE (Western and Northern)

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Leica INS3300 is the most advanced solution in the production control of 200 mm and 300 mm wafers. This compa Year(s) : 2003 Location : EUROPE (Western and Northern)

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Karl Suss MA8/BA6 Mask Aligner consisting of: - Model: MA8/BA6 - Configured for Topside Alignment (TSA) Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)

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Nikon Eclipse L200N Microscope consisting of: - Model: Eclipse L200N - L200N Stand with built in Transformer ( Year(s) : 2017 Location : AMERICA North (USA-Canada-Mexico)

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GROSS LEAK PRESSURE SYSTEM Location : AMERICA North (USA-Canada-Mexico)

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4410 sputtering system 3 DELTA TARGETS CTI CRYOPUMP AND COMPRESSOR Vacuum Valves Rebuilt NEW HMI/PLC, REBUILT Location : AMERICA North (USA-Canada-Mexico)

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Used Semiconductor and PCB Manufacturing for sale

You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).

Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.

Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.

This industry is largely located in Asia and expecially in China.

The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES) 

The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14

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