Used Semiconductor and PCB Manufacturing
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Will be sold in refurbished condition Year(s) : 2000 Location : EUROPE (Western and Northern)
Price : On request
More detailsNitto De-Taper, sold in working condition Year(s) : 1999 Location : EUROPE (Western and Northern)
Price : On request
More detailsTEL Mark-7 Track 2C 3D installed as is where is 50% down, and 50% prior to deinstall Location : EUROPE (Western and Northern)
Price : On request
More detailsSOG Spin Coat L Configuration - Load on the Left, Cure Furnace on the Right 25 Slot Cassette Oven type: (4) H Year(s) : 2015 Location : EUROPE (Western and Northern)
Price : On request
More detailsMain Controller Type: NA Wafer Flow: Right to Left Co Year(s) : 2004 Location : EUROPE (Western and Northern)
Price : On request
More detailsFull setup with Camera, Monitor, Heated work holder, microscope, light source for microscope. Setup was remo Location : EUROPE (Western and Northern)
Price : On request
More detailsWire Bonder Model Maxum Location : EUROPE (Western and Northern)
Price : On request
More detailsWorking condition Location : EUROPE (Western and Northern)
Price : On request
More detailsBonders Model EAGLE AERO Year(s) : 2018 Location : EUROPE (Western and Northern)
Price : On request
More detailsThis Orthodyne 20 Ultrasonic Heavy Wire Bonder with Wire Dereeler looks to be in good cosmetic condition, sh Location : EUROPE (Western and Northern)
Price : On request
More detailsThis K&S (Kulicke & Soffa) model 4124 Manual Gold Ball Wire Bonder looks to be in good cosmetic condition, sh Location : EUROPE (Western and Northern)
Price : On request
More detailsWire Bonders Model Eagle Xtreme Year(s) : 2012 Location : EUROPE (Western and Northern)
Price : On request
More detailsKulicke and Soffa (K&S) 4123 Wire Bonder General Specs: Wire Diameter Range : Gold - 0.5 to 3.0 mils (12.7 to Location : EUROPE (Western and Northern)
Price : On request
More detailsThis K&S (Kulicke & Soffa) model 4124 Manual Gold Ball Wire Bonder looks to be in good cosmetic condition, sho Location : EUROPE (Western and Northern)
Price : On request
More details- Model: ABC200 - MHU - Main Handling Unit w/ Genmark GB8 Robot - Module 1: BA200 – Bond Aligner - Module 2: N Location : EUROPE (Western and Northern)
Price : On request
More detailsA MXP ETCH B MXP ETCH C MXP ETCH Good Condition Year(s) : 1997 Location : EUROPE (Western and Northern)
Price : On request
More detailsType: ICP HR Etch System Wafer Size: 8" Location : EUROPE (Western and Northern)
Price : On request
More detailsDual etch chamber system with handler Model 602E Year(s) : 2002 Location : EUROPE (Western and Northern)
Price : On request
More detailsWire Bonder Model Eagle 60 Year(s) : 2007 Location : EUROPE (Western and Northern)
Price : On request
More detailsIncludes Hesse DA 04 051 Deep Access Bondhead & Light Tower; Number of Bonds Approx 37,054,610; Dimensions o Year(s) : 2009 Location : EUROPE (Western and Northern)
Price : On request
More details7 sets ASM Harrier Bonders Vintage 2009~2010 Working condition Year(s) : 2009, 2010 Location : EUROPE (Western and Northern)
Price : On request
More detailsThis West-Bond 545657B is a Semi-Automatic Three-Way Convertible 45° Wire Feed Wedge, 90° Wire & Ribbon Feed Location : EUROPE (Western and Northern)
Price : On request
More detailsDie Bonder Model AD809M-06 Year(s) : 2002 Location : EUROPE (Western and Northern)
Price : On request
More detailsIncludes: FINEPLACER lambda Bonding force module FD3 Chip heating module Optional Dispensing Module FG3 WinFli Year(s) : 2017 Location : EUROPE (Western and Northern)
Price : On request
More detailsASM AD898 die bonder, 2 sets ASM AD898 for sale Ex works China , both vintage 2006, Can Trial Run. Year(s) : 2002 Location : EUROPE (Western and Northern)
Price : On request
More detailsUsed Semiconductor and PCB Manufacturing for sale
You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).
Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.
Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.
This industry is largely located in Asia and expecially in China.
The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES)
The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14