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Used Semiconductor and PCB Manufacturing

9,441 results
1

Board Inspection Test Model S3054QS Year(s) : 2004 Location : EUROPE (Western and Northern)

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4mega camera 8 way projection includes Review station computer. - Optional (not included) : Offline Teaching Year(s) : 2013 Location : EUROPE (Western and Northern)

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With 4 Feeer Trollies With 4 x CPA 20 Heads Year(s) : 2011, 2016 Location : EUROPE (Western and Northern)

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• CE mark • Hawkeyes 750 camera system • Window 10 * ASM Frame, For stencil mount adjustment * All options ad Year(s) : 2015 Location : EUROPE (Western and Northern)

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Reflow Oven Year(s) : 2010 Location : ASIA (North East)

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Wafer Size 300 mm Fab Section Failure Analysis Tool Available Date 2024-08-27 General Product Information Vin Year(s) : 2011 Location : United States (USA)

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Wafer Size 300 mm Fab Section Defect Detection General Product Information Vendor Supplier AMAT Model UVision Year(s) : 2014 Location : United States (USA)

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Wafer Size 200 mm Fab Section Implant General Product Information Software Version 13.42.18 CIM GEM and SECS Year(s) : 2007 Location : United States (USA)

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Automated Fluid Dispenser 120V Year(s) : 1998 Location : AMERICA North (USA-Canada-Mexico)

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Wire Bonder Model 3088 Location : AMERICA North (USA-Canada-Mexico)

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Laser System Brand Epilog Vintage : AUG 2010 Model: 9000 Laser System 36"x24" Work Area 120W Year(s) : 2010 Location : AMERICA North (USA-Canada-Mexico)

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Specifications Method: Forced circulation exhaust Operating temperature range: Room temperature +5 to 70℃* She Location : ASIA (North East)

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[Specifications] ○Printing laser: Yb fiber laser, class 4 laser ○Laser wavelength: 1060nm ○Printing laser aver Location : ASIA (North East)

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Currently tool is still warm down Condition Good Year of Manufacture 2006 Year(s) : 2006 Location : EUROPE (Western and Northern)

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Condition Good Year of Manufacture 2007 Weight 871 lb (395 kg) Exterior Dimensions Width 37.008 in Year(s) : 2007 Location : EUROPE (Western and Northern)

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Working for ultrasonic cleansing. Some parts which not in process flow incomplete and not working (COT and s Year(s) : 1995 Location : EUROPE (Western and Northern)

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Wafer Size 300 mm Fab Section Lab General Product Information Vendor Supplier FEI Model FEI ExSolve CLM Next Year(s) : 2016 Location : United States (USA)

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Wafer Size 200 mm Fab Section Clean General Product Information Vendor Supplier Fusion Semiconductor Model 20 Year(s) : 1993 Location : United States (USA)

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Excimer Cleaning Device Lamp type: UEM20-172 Irradiation area: φ100mm Purge gas: N2 External dimensions: Appro Year(s) : 2006 Location : ASIA (North East)

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Specifications ●Set temperature and humidity range Temperature control: 5℃ to 40℃ When controlling temperature Location : ASIA (North East)

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DOM: 11/14/2014 TPSYS: 3.3.2g SW Options: Electrical Two-Pole Test Electrical Transistor Test Optical Cent Location : AMERICA North (USA-Canada-Mexico)

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Magazine loader with exchange magazine and paper interleave function. Year(s) : 2004 Location : EUROPE (Western and Northern)

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6 head driller, Mechatronic PX 250 spindles, IPF3 option. Year(s) : 2010 Location : EUROPE (Western and Northern)

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FIFO buffer suitable for 60 panels. Year(s) : 2001 Location : EUROPE (Western and Northern)

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With: Shutter at the outlet Shutter at the inlet Outlet conveyor 530mm El. and auto width for outlet convey Year(s) : 2020 Location : AMERICA North (USA-Canada-Mexico)

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Used Semiconductor and PCB Manufacturing for sale

You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).

Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.

Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.

This industry is largely located in Asia and expecially in China.

The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES) 

The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14

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