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Used Semiconductor and PCB Manufacturing

9,441 results
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Wafer Size 300 mm Fab Section Metrology General Product Information Vendor Supplier BRUKER Model D8 Fabline V Year(s) : 2014 Location : United States (USA)

Price : On request

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Screen Printer Model KS-1700 Location : ASIA (North East)

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KLA-TENCOR SURFSCAN SP1 DLS UNPATTERNED SURFACE INSPECTION SYSTEM consisting of: - Model: SP1 DLS with 300mm S Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size 200 mm Fab Section Thin Film General Product Information Vendor Supplier Lam Research Model Novell Year(s) : 2000 Location : United States (USA)

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Wafer Size 200 mm Fab Section Clean General Product Information Vendor Supplier CFM Model FullFlow 1/99 8100 Year(s) : 1999 Location : United States (USA)

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Wafer Size 200 mm Fab Section Thin Film General Product Information Vendor Supplier AMAT Model ENDURA P5500 V Year(s) : 2000 Location : United States (USA)

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With: Shutter at the outlet Shutter at the inlet Outlet conveyor 530mm El. and auto width for outlet convey Year(s) : 2020 Location : AMERICA North (USA-Canada-Mexico)

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200mm As-is KLA / MicroSense UMA-C200-STR Thin Film Stress Measurement System consisting of: - Vintage: Appro Year(s) : 2019 Location : EUROPE (Western and Northern)

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PLASMATHERM ODYSSEY HDRF ASHER consisting of: - Model: Odyssey HDRF - Configured for 150mm wafers - 2 Chambers Location : EUROPE (Western and Northern)

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Suss MJB3 submicron mask aligner with 350w lamphouse and splitfield optics Splitfield microscope Leica objec Location : EUROPE (Western and Northern)

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DOM: 11/18/08 with the following Options: Enhanced 2D inspection EZ Teach Year(s) : 2008 Location : AMERICA North (USA-Canada-Mexico)

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V Finger Conveyor 18" Max Width Ultrasonic Systems, Inc. OPTI II External Fluxer 3 Bottom Convection Preheater Year(s) : 2011 Location : AMERICA North (USA-Canada-Mexico)

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Manufacturer L & G Technology Condition Good Exterior Dimensions Width 31.496 in (80.0 cm) Depth 4 Year(s) : 2003 Location : EUROPE (Western and Northern)

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Detaping 6" thinwafer Wafer Size Range Minimum 200 mm Maximum 200 mm Set Size 200 mm Cassette to Ca Year(s) : 2006 Location : EUROPE (Western and Northern)

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Condition Fair Exterior Dimensions Width 283.465 in (720.0 cm) Depth 70.866 in (180.0 cm) Heigh Year(s) : 1999 Location : EUROPE (Western and Northern)

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Batch Cleaner Model Trident III Location : AMERICA North (USA-Canada-Mexico)

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Solder Paste Inspection Machine Model SE500 SPI Year(s) : 2010 Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size 200 mm Fab Section Clean General Product Information Vendor Supplier CFM Model FullFlow 1/99 8100 Year(s) : 1999 Location : United States (USA)

Price : On request

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Wafer Size 300 mm Fab Section Thin Film General Product Information Vendor Supplier AMAT Model Producer SE Vi Year(s) : 2011 Location : United States (USA)

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Mini-Pot for Through-Hole Rework, Selective Soldering and Desoldering Precision Controls for Repeatability Le Year(s) : 2017 Location : AMERICA North (USA-Canada-Mexico)

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UV light-curable adhesives, coatings, inks, gaskets, masks, and more. Conveyor has a 26" wide belt and an act Location : AMERICA North (USA-Canada-Mexico)

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User-friendly software with touchscreen Repeatability ± 12,5 μm @ 6 Sigma Print format up to 510 x 360 mm boar Year(s) : 2020 Location : AMERICA North (USA-Canada-Mexico)

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Max KV: 160KV Operating system : Windows 10 Detector : Flat Panel Max tube power : 10W Tube NT500 Condition : Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Minimum 200 mm Maximum 300 mm Set Size 300 mm Cassette to Cassette YES Wafer Hand Location : AMERICA North (USA-Canada-Mexico)

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Front of Line Magazine Unloader DOM: 04/2011 Touch display and graphical user interface Magazine Max Size: 21. Year(s) : 2011 Location : AMERICA North (USA-Canada-Mexico)

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Used Semiconductor and PCB Manufacturing for sale

You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).

Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.

Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.

This industry is largely located in Asia and expecially in China.

The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES) 

The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14

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