Used Semiconductor and PCB Manufacturing
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Die Bond Datacon 2200 evo Model:EVO2200:Die Attach Bonder Accessories Power Supply : 230 VAC Power Consumption Year(s) : 2010 Location : EUROPE (Western and Northern)
Price : On request
More detailsCondition Very Good Year of Manufacture 2007 Year(s) : 2007 Location : EUROPE (Western and Northern)
Price : On request
More detailsOXFORD PLASMALAB 100 PECVD consisting of: - Model: Plasmalab 100 PECVD - Process: SiO2 and SiN deposition - Ma Year(s) : 2008 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsUltratech Titan 4700 Stepper consisting of: - Model: Titan 4700 Stepper (Enclosure marked as 6700) - G & H Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsUp to 34″ Aisle Opening Totally Enclosed for Safety PLC Controls with SMEMA Cables Hand Crank Width Adjustment Year(s) : 2006 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsFully Automatic 300mm wafer prober, Dual FIMS loadport, Cold (-25c, ambiant and hot) Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsOvens Equipment Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsAutomated High Resolution Stylus Profiler, for 150 and 200 mm Wafer Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details4 Port 200mm wafer Sorter Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsInspection: PCB Location : ASIA (North East)
Price : On request
More detailsLenght (cm) 220 Width (cm) 140 Height (cm) 195 Weight (kg) 1900 Inline yes Power Requirement 400V , 15A needs Year(s) : 2007 Location : EUROPE (Western and Northern)
Price : On request
More detailsLenght (cm) 50 Width (cm) 73 Height (cm) 133 Weight (kg) 112 Inline Yes Power Requirement 230 v Needs air yes Year(s) : 2011 Location : EUROPE (Western and Northern)
Price : On request
More detailsLenght (cm) 104,5 Width (cm) 60 Height (cm) 173,3 Weight (kg) 270 Inline yes Power Requirement (volt) 230 Need Year(s) : 2002 Location : EUROPE (Western and Northern)
Price : On request
More detailsCVD: MOCVD/4in. Year(s) : 2001 Location : ASIA (North East)
Price : On request
More detailsION:Implanter/6in Location : ASIA (North East)
Price : On request
More detailsCVD: MOCVD/4in. Year(s) : 2010 Location : ASIA (North East)
Price : On request
More detailsStepper Location : ASIA (North East)
Price : On request
More details200mm Suss AS8 Spray Coater The tool is a semi-automated resist spray coater system which is equipped with t Year(s) : 2016 Location : EUROPE (Western and Northern)
Price : On request
More detailsVintages: 3x 1995 1x1996 Configuration: left inline system; Inline with TEL Mark 7-S Coater Developer 8" w Year(s) : 1995, 1996 Location : EUROPE (Western and Northern)
Price : On request
More detailsWJ999R with 996-9 Handler Fully Operational With HDD Still installed in FAB Year(s) : 1998 Location : EUROPE (Western and Northern)
Price : On request
More detailsKLA-TENCOR SP1 TBI UNPATTERNED SURFACE INSPECTION SYSTEM consisting of: - Model: SP1 TBI - Up to 300mm Wafers Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsKLA-TENCOR 5200XP OVERLAY REGISTRATION SYSTEM consisting of: - Model: 5200XP - Overlay Registration(stepper al Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsNikon Microscope w/ Irvine Optical Ultrastation consisting of: - Irvine Optical Corp Model 3.E - Objectives: Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsFIFO Large board buffer Date - 2010 MACHINE SIZES - XL NTM 640SXL Machine L x W x H (mm) 653 x 1130 x 1700 W Year(s) : 2010 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details(8) Heating Zones (2) Cooling Zones Air Edge Rail & Mesh Belt Conveyors Windows XP Operating System 350° Max T Year(s) : 2010 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsUsed Semiconductor and PCB Manufacturing for sale
You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).
Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.
Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.
This industry is largely located in Asia and expecially in China.
The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES)
The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14