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Used Semiconductor Equipment

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3

Grinder Heavy smoker DTU 150 Chiller DVC 010 Vacuum coolant unit Air supply source: Pressure: 0.5-0.8 MPa Location : ASIA (South East)

Price : On request

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Flip Chip Bonder Model FCB3 Year(s) : 2011 Location : EUROPE (Western and Northern)

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Can be set up for dotting or dispense epoxy Year(s) : 2019 Location : EUROPE (Western and Northern)

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Die Bonder Model MCM-12 Year(s) : 2011 Location : EUROPE (Western and Northern)

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coat: TRACK(1C3D) Location : ASIA (North East)

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cvd: LPCVD/TEOS Location : ASIA (North East)

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K&S 4522 Manual Gold Ball Wire Bonder With heated work holder. For process development, production, research Location : AMERICA North (USA-Canada-Mexico)

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K&S 4524 Manual Gold Ball Bonder. Versatile production capabilities for bonding applications from simple to Location : AMERICA North (USA-Canada-Mexico)

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good condition Location : EUROPE (Western and Northern)

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Will be sold in refurbished condition Year(s) : 2000 Location : EUROPE (Western and Northern)

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Nitto De-Taper, sold in working condition Year(s) : 1999 Location : EUROPE (Western and Northern)

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CVD: APCVD/6in Location : ASIA (North East)

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TEL Mark-7 Track 2C 3D installed as is where is 50% down, and 50% prior to deinstall Location : EUROPE (Western and Northern)

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Burn: inserter/extractor Year(s) : 1991 Location : ASIA (North East)

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Aligner Location : ASIA (North East)

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1

SOG Spin Coat L Configuration - Load on the Left, Cure Furnace on the Right 25 Slot Cassette Oven type: (4) H Year(s) : 2015 Location : EUROPE (Western and Northern)

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Main Controller Type: NA Wafer Flow: Right to Left Co Year(s) : 2004 Location : EUROPE (Western and Northern)

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Dic: Scribe Machine Year(s) : 2000 Location : ASIA (North East)

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Dic: Scribe Machine Year(s) : 2000 Location : ASIA (North East)

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Cascade Microtech Summit 12000 200mm Prober with Attoguard Microchamber and -65°C to 200°C Shielded Chuck. C Location : AMERICA North (USA-Canada-Mexico)

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Dage 4000 TPAXY Modular Wire Pull/Die Shear Bond Tester. Intuitive operating screens enable quick test set up Location : AMERICA North (USA-Canada-Mexico)

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Full setup with Camera, Monitor, Heated work holder, microscope, light source for microscope. Setup was remo Location : EUROPE (Western and Northern)

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Wire Bonder Model Maxum Location : EUROPE (Western and Northern)

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RTP/6in. Year(s) : 2019 Location : ASIA (North East)

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• Wafer Size Capability: 5 – 8 inch • Version: 150 mm • Beam Energy: Up to 200 keV • Dose Range: 1×10¹⁰ – 1×10 Year(s) : 2006 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

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You can find used Semiconductor Equipment on Wotol

For second hand Semiconductor Equipment we have Wafer Equipment, Wafer Handler & Robots, CVD Equipment, Wet Bench, Lithography & Photoresist, Plasma Etcher / Asher, Dicer & Scriber, Grinding, Lapping & Polishing, Component Counters/Tapers, Dry Pump, Bonder, Metrology and inspection equipment. The main manufacturers for used Semiconductor Equipment are KLA-Tencor, Plasmatherm, AMAT, TEL, Disco, Karl Suss, Canon, Semitool, Hitachi, Nanometrics, Nikon, Applied Materials, Tegal, Varian.

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