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Used Semiconductor Equipment

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ESEC 2100 FC HS Die Bonder De-installed. It should be complete, so they must go by the photos. Year(s) : 2017 Location : EUROPE (Western and Northern)

Price : On request

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 Wafer Diameter Maximum 12" (300 mm)  Wafer XY Table Travel (13” x 13”) 334 x 334mm  Die Size (10 x 10 mil Year(s) : 2003 Location : EUROPE (Western and Northern)

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Stepper/6in. Location : ASIA (North East)

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• Vacuum Units: 1 (second unit optional) • Press Capacity: 60 tons • Stroke Count: 62,133 • Features: Alarm & Year(s) : 2003 Location : EUROPE (Western and Northern)

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• Wafer Size: 200 mm • Chuck Type: Temperature controlled (no chiller or controller included) • Microscope: Mi Location : AMERICA North (USA-Canada-Mexico)

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GE Phoenix Micromex 180 KV PCBA X-ray System DOM: 3/2008 180KVA Year(s) : 2008 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

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• AOI microscope • Load Ports: 2 units of Brooks load port • Version: 300 mm • Sales Condition: As is where is Location : AMERICA North (USA-Canada-Mexico)

Price : On request

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KLA-TENCOR Opti-2600 Thickness Measurement Year(s) : 1995 Location : EUROPE (Western and Northern)

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KLA RS55/TCA Was complete and working condition before de-install Year(s) : 2005 Location : EUROPE (Western and Northern)

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This is being sold refurbished with a 3 months parts warranty. Its currently configured with SMIF but can be Year(s) : 1999 Location : EUROPE (Western and Northern)

Price : On request

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• Type: Field Emission SEM with EDX • Version: Laboratory • Sales Condition: As is where is • Lead Time: Immed Year(s) : 2017 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

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BREAKER SCRIBER (NEW TOUCH SCREEN CONTROLS Location : AMERICA North (USA-Canada-Mexico)

Price : On request

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• Speed: 3450 RPM • Function: Tool Grinder / End Mill Sharpener Location : AMERICA North (USA-Canada-Mexico)

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EVAPORATION UNIT Year(s) : 1988 Location : ASIA (North East)

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Grinder Location : ASIA (North East)

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Wire saw Year(s) : 2014 Location : ASIA (North East)

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Aixtron Crius II MOCVD Vintage 2011 Removed from production in 2019 Year(s) : 2011 Location : EUROPE (Western and Northern)

Price : On request

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Scanning Electron Microscope Model S 4500 SEM Year(s) : 1994 Location : EUROPE (Western and Northern)

Price : On request

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KLA-Tencor UV 1280 SE Film Thickness Measurement Tool 6", 8" 2001 Vintage Year(s) : 2001 Location : EUROPE (Western and Northern)

Price : On request

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X-Ray System Model YTX-3000 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

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IS Alcalic etch line, line left to right, line length 4.4m Year(s) : 2002 Location : EUROPE (Western and Northern)

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vertical feed ultrasonic wedge bonder. Location : AMERICA North (USA-Canada-Mexico)

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• Type: Wire Bonder • Bonding Type: Ball bonder • Optics: Includes stereo zoom optics • Optics Option: Upgrade Location : AMERICA North (USA-Canada-Mexico)

Price : On request

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• Type: Wire Bonder • Feed Type: Vertical feed • Options: Heated work holders available • Options: Heated tran Location : AMERICA North (USA-Canada-Mexico)

Price : On request

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X-ray Inspection System Model FXS 100.24 Microfocus Location : AMERICA North (USA-Canada-Mexico)

Price : On request

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You can find used Semiconductor Equipment on Wotol

For second hand Semiconductor Equipment we have Wafer Equipment, Wafer Handler & Robots, CVD Equipment, Wet Bench, Lithography & Photoresist, Plasma Etcher / Asher, Dicer & Scriber, Grinding, Lapping & Polishing, Component Counters/Tapers, Dry Pump, Bonder, Metrology and inspection equipment. The main manufacturers for used Semiconductor Equipment are KLA-Tencor, Plasmatherm, AMAT, TEL, Disco, Karl Suss, Canon, Semitool, Hitachi, Nanometrics, Nikon, Applied Materials, Tegal, Varian.

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