Used Semiconductor Equipment

General Product Information Vendor Supplier LINTECH Model RAD-3510F/12 Vintage 2012 Asset Description BSL900-T Year(s) : 2012 Location : United States (USA)

Price : On request

Transaction Information Tool ID OP 922 Tool Status Connected Wafer Size 300 mm Fab Section Defect Detection Year(s) : 2007 Location : United States (USA)

Price : On request

OAI Model 806 MBA NUV 4" Mask Aligner is a four-camera, manual, optical backside mask aligner system that is d Location : AMERICA North (USA-Canada-Mexico)

Price : On request

DOM 6/2017 Per the OEM: As the true 3D AOI system, ZENITH LiTE effectively measures solder joints and compo Year(s) : 2017 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Manufacturer: ESEC Type: Smart Card Wire Bonder Model: ESEC 3100 SCplus Location : EUROPE (Western and Northern)

Price : On request

ICP-PECVD deposition system for solar wafers Version: 156 mm square (200 mm) Vintage: 01.06.2015 PECVD deposi Year(s) : 2015 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

6 inch vintage: 1995 As-is condition Complete with no missing parts Working condition before decommissioned P Year(s) : 1995 Location : EUROPE (Western and Northern)

Price : On request

Tool Status Connected Wafer Size NA Fab Section Failure Analysis Asset Description Zeiss Merlin Scanning Ele Year(s) : 2010 Location : EUROPE (Western and Northern)

Price : On request

Common Features of All 7500 Series Systems • Compact benchtop design permits easy integration into existing la Year(s) : 2010 Location : EUROPE (Western and Northern)

Price : On request

CVD: MOCVD Location : ASIA (North East)

Price : On request

Vendor Supplier DISCO Model DGP8761/Type DP Vintage 2018 Asset Description BSG903U1-TR DISCO DFM2800 Fully au Location : United States (USA)

Price : On request

Wafer Size 300 mm Fab Section Metrology General Product Information Vendor Supplier AMAT Model Verity1 SEM Vi Year(s) : 2005 Location : United States (USA)

Price : On request

Condition: good Exterior Dimensions Width 27.559 in (70.0 cm) Depth 27.559 in (70.0 cm) Height 76.3 Year(s) : 2004 Location : EUROPE (Western and Northern)

Price : On request

Condition Refurbished S-1160B-4N Precision Manual Analytical Probe Station configured with 4" chuck upgradable Location : EUROPE (Western and Northern)

Price : On request

Condition Good Exterior Dimensions Width 50.000 in (127.0 cm) Depth 86.614 in (220.0 cm) Height 74.0 Year(s) : 2004 Location : EUROPE (Western and Northern)

Price : On request

This West-Bond West-Bond 7372B Convertible Die Bonder can be converted between a 7200B Epoxy Die Bonder, and Location : EUROPE (Western and Northern)

Price : On request

PECVD 80+ SiO2 Dep Non-functional tool but can be repaired (requires Silane MFC) Designed for 4” wafers but ca Location : EUROPE (Western and Northern)

Price : On request

This West-bond 7400A Manual Ultrasonic/ Thermosonic 45° Feed Wedge-Wedge Wire Bonder looks to be in good cosm Location : EUROPE (Western and Northern)

Price : On request

5200, 200mm, s/n: 2070 Year(s) : 2000 Location : United States (USA)

Price : On request

Raider ECD310 Year(s) : 2006 Location : United States (USA)

Price : On request

Wafer Size 300 mm Fab Section Diffusion General Product Information Vendor Supplier APPLIED MATERIALS Model C Year(s) : 2006 Location : United States (USA)

Price : On request

Wafer Size 300 mm Fab Section Thin Film General Product Information Vendor Supplier AMAT Model FRONTIER - Etc Year(s) : 2015 Location : United States (USA)

Price : On request

Three MaxumPlus Bonders upgraded by KNS from Maxum. Year(s) : 2004 Location : EUROPE (Western and Northern)

Price : On request

Microscope autoloader only (Not including the microscope) Version: 100 MM AND 150 mm -Deinstalled to warehouse Location : AMERICA North (USA-Canada-Mexico)

Price : On request