Used Semiconductor Equipment

Wafer Size 300 mm Fab Section Metrology General Product Information Vendor Supplier HSEB (now Unity SC) Model Year(s) : 2007 Location : United States (USA)

Price : On request

Wafer Size 200 mm Fab Section Etch General Product Information Vendor Supplier LAM Model 9600 BRME Vintage 19 Year(s) : 1998 Location : United States (USA)

Price : On request

Condition Good Exterior Dimensions Width 50.000 in (127.0 cm) Depth 86.614 in (220.0 cm) Height 74.0 Year(s) : 2003 Location : EUROPE (Western and Northern)

Price : On request

Double sided exposure unit, including film punch. Manual exposure unit is provided with Glass/Glass accutray-d Year(s) : 2011 Location : EUROPE (Western and Northern)

Price : On request

Condition Good Exterior Dimensions Width 27.559 in (70.0 cm) Depth 27.559 in (70.0 cm) Height 78.268 Year(s) : 2003 Location : EUROPE (Western and Northern)

Price : On request

Tool Status Disconnected Wafer Size 300 mm Fab Section Support Tools General Product Information Vendor Suppl Year(s) : 2009 Location : United States (USA)

Price : On request

Wafer Size 300 mm Fab Section Thin Film Asset Description THK2550-T - THK2550FP RUDOLPH S3000S (MT) Software Year(s) : 2011 Location : United States (USA)

Price : On request

- Type: Defect Inspection Tool - Wafer Size: 200 mm - Software Version: 5.3.17 - Interface: CIM SECS, GE Year(s) : 2000 Location : United States (USA)

Price : On request

3 daylight Multilayer vacuum press, PC control, weight 4.500 kg, incl. loading lift, 7 vacuum windows for max Location : EUROPE (Western and Northern)

Price : On request

AIT, 200mm, s/n: 0597-8087 Location : United States (USA)

Price : On request

Condition: very good Yushin Demounter 1 3Teile Glas Demount Tool for 6 and 8 inch Wafer. Glas Output Statio Year(s) : 2006 Location : EUROPE (Western and Northern)

Price : On request

200mm, s/n: 9152 AIT II w/ ADC. Defect Inspection Year(s) : 2000 Location : United States (USA)

Price : On request

AIT II, 200mm, s/n: 9262 Year(s) : 2009 Location : United States (USA)

Price : On request

Oxide film thickness measurement (PC missing) Version: 200 mm Year(s) : 2003 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

CVD: MOCVD/2-4in Year(s) : 2010, 2012 Location : ASIA (North East)

Price : On request

Nanospec Wafer Metrology film thickness measurement tool Version: 200 mm Year(s) : 2005 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Inspection: AOI Year(s) : 2010 Location : ASIA (North East)

Price : On request

Mask & Wafer Inspection Working condition Year(s) : 2008 Location : EUROPE (Western and Northern)

Price : On request

Eye Piece: SWH10 x /26.5 Objective lens: MpanFLN x5 x10 x20 Working Condition Year(s) : 2015 Location : EUROPE (Western and Northern)

Price : On request

Photo-lithography 248 NM DUV Scanner with photo-track Version: 300 MM Vintage: 01.06.2002 The equipmewnt has Year(s) : 2002 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Vintage: 01.05.1997 Cassette to Cassette Handling of 200mm Wafers Non-Contact Wafer Pre-Alignment Trinocular H Year(s) : 1997 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Wafer Inspection Microscope •5 Position Turret with Motorized Rotation •CF Plan 2.5X Bright/Darkfield Object Location : AMERICA North (USA-Canada-Mexico)

Price : On request

CMP metrology system Version: 300 mm -De-installed, warehoused. Can be inspected by appointment. -Has CE mark Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Ellipsometer for CD and thin film measurements Version: 300 mm Vintage: 01.01.2018 Nova Instruments T600 Multi Year(s) : 2018 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Wafer Inspection Microscope with autoloader Version: 100 MM AND 150 mm In good working condition Has CE safety Location : AMERICA North (USA-Canada-Mexico)

Price : On request