Used Semiconductor Equipment

Manufacturer: ESEC Type: Smart Card Wire Bonder Model: ESEC 3100 SCplus Location : EUROPE (Western and Northern)

Price : On request

ICP-PECVD deposition system for solar wafers Version: 156 mm square (200 mm) Vintage: 01.06.2015 PECVD deposi Year(s) : 2015 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

6 inch vintage: 1995 As-is condition Complete with no missing parts Working condition before decommissioned P Year(s) : 1995 Location : EUROPE (Western and Northern)

Price : On request

Tool Status Connected Wafer Size NA Fab Section Failure Analysis Asset Description Zeiss Merlin Scanning Ele Year(s) : 2010 Location : EUROPE (Western and Northern)

Price : On request

Common Features of All 7500 Series Systems • Compact benchtop design permits easy integration into existing la Year(s) : 2010 Location : EUROPE (Western and Northern)

Price : On request

CVD: MOCVD Location : ASIA (North East)

Price : On request

Condition: good Exterior Dimensions Width 27.559 in (70.0 cm) Depth 27.559 in (70.0 cm) Height 76.3 Year(s) : 2004 Location : EUROPE (Western and Northern)

Price : On request

Condition Refurbished S-1160B-4N Precision Manual Analytical Probe Station configured with 4" chuck upgradable Location : EUROPE (Western and Northern)

Price : On request

Condition Good Exterior Dimensions Width 50.000 in (127.0 cm) Depth 86.614 in (220.0 cm) Height 74.0 Year(s) : 2004 Location : EUROPE (Western and Northern)

Price : On request

Plasma Etch System: It uses a plasma-based process to selectively remove materials from the wafer surface, suc Location : AMERICA North (USA-Canada-Mexico)

Price : On request

This West-Bond West-Bond 7372B Convertible Die Bonder can be converted between a 7200B Epoxy Die Bonder, and Location : EUROPE (Western and Northern)

Price : On request

PECVD 80+ SiO2 Dep Non-functional tool but can be repaired (requires Silane MFC) Designed for 4” wafers but ca Location : EUROPE (Western and Northern)

Price : On request

This West-bond 7400A Manual Ultrasonic/ Thermosonic 45° Feed Wedge-Wedge Wire Bonder looks to be in good cosm Location : EUROPE (Western and Northern)

Price : On request

Three MaxumPlus Bonders upgraded by KNS from Maxum. Year(s) : 2004 Location : EUROPE (Western and Northern)

Price : On request

Microscope autoloader only (Not including the microscope) Version: 100 MM AND 150 mm -Deinstalled to warehouse Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Large Area PECVD system, used for SiO and SiN process depositions Version: 150 mm Vintage: 01.06.2015 Plasmat Year(s) : 2015 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Double sided exposure unit, including film punch. Manual exposure unit is provided with Glass/Glass accutray-d Year(s) : 2011 Location : EUROPE (Western and Northern)

Price : On request

Condition: very good Yushin Demounter 1 3Teile Glas Demount Tool for 6 and 8 inch Wafer. Glas Output Statio Year(s) : 2006 Location : EUROPE (Western and Northern)

Price : On request

Oxide film thickness measurement (PC missing) Version: 200 mm Year(s) : 2003 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

CVD: MOCVD/2-4in Year(s) : 2010, 2012 Location : ASIA (North East)

Price : On request

Nanospec Wafer Metrology film thickness measurement tool Version: 200 mm Year(s) : 2005 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Inspection: AOI Year(s) : 2010 Location : ASIA (North East)

Price : On request

Mask & Wafer Inspection Working condition Year(s) : 2008 Location : EUROPE (Western and Northern)

Price : On request

Eye Piece: SWH10 x /26.5 Objective lens: MpanFLN x5 x10 x20 Working Condition Year(s) : 2015 Location : EUROPE (Western and Northern)

Price : On request

Photo-lithography 248 NM DUV Scanner with photo-track Version: 300 MM Vintage: 01.06.2002 The equipmewnt has Year(s) : 2002 Location : AMERICA North (USA-Canada-Mexico)

Price : On request