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Used Semiconductor Equipment

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1

cel: Polarizer taper Year(s) : 2015 Location : ASIA (North East)

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Inspection: Wafer Year(s) : 2013 Location : ASIA (North East)

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- Cryo Compressor - Vacuum Pump Location : AMERICA North (USA-Canada-Mexico)

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Stepper Model 1600 Year(s) : 2001 Location : EUROPE (Western and Northern)

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Precision dicing saw SEM and TEM Location : EUROPE (Western and Northern)

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NOVELLUS, INOVA NEXT, 300mm Tool ID: MDX2951 Year(s) : 2013 Location : EUROPE (Western and Northern)

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Inspection: Wafer Maker KLA-Tencor Model Altair 8900 Year(s) : 2014 Location : ASIA (North East)

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TCDEV-26 TEL ACT 8 COATER/DEVELOPER (ex CTDV-A19) Year(s) : 2000 Location : United States (USA)

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TCDEV-30 TEL ACT 8 COATER/DEVELOPER(former CTDV-A17) TEL ACT8, 200mm Year(s) : 1999 Location : United States (USA)

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TRACK TEL ACT8 200mm Location : United States (USA)

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Manual wafer load substrate bonder Capable of fusion compression bonding Capable of thermal compression bondin Year(s) : 2008 Location : AMERICA North (USA-Canada-Mexico)

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Thin film measurement tool Broadband UV optics Dual beam spectrophotometry Wafer sizes: 100mm, 150mm, and 200m Location : AMERICA North (USA-Canada-Mexico)

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Manual wafer load substrate bonder Set up for fusion compression bonding, thermal compression bonding, and an Location : AMERICA North (USA-Canada-Mexico)

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The Oxford Plasmalab 100 is a modular plasma processing system. It can be configured to carry out Reactive I Location : AMERICA North (USA-Canada-Mexico)

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Wafer sorter for 300mm wafer Version: 300mm De-installed, warehoused. Can be inspected by appointment. 2 port Location : AMERICA North (USA-Canada-Mexico)

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Mask Aligner with CIC1000 lamp housing Version: 200 mm The machine was in working condition up until it was Year(s) : 2019 Location : AMERICA North (USA-Canada-Mexico)

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FEATURES - HYBOND Soft TouchTM energy system. - Front panel ultrasonic test button. - Deep vertical access of Location : AMERICA North (USA-Canada-Mexico)

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552 is a wedge bonder with thermocompression Location : AMERICA North (USA-Canada-Mexico)

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572 is a Vertical Feed Ultrasonic Wedge/ Wire Bonder Location : AMERICA North (USA-Canada-Mexico)

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Model 365 Capabilities: Cures most UV tape in 5 seconds Large exposure area cures up to 300mm wafers. Location : AMERICA North (USA-Canada-Mexico)

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Polisher Grinder with Vector LC Power Head. Buehler Metaserv 3000 single plate automatic polishing machine wit Location : AMERICA North (USA-Canada-Mexico)

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Bandit Rework Station with CD and Manuals USED, AS IS CONDITION Location : AMERICA North (USA-Canada-Mexico)

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200mm TCDEV-24 JUSTIN ACT TRACK FOR 0.25um (former TCDEV-39) Year(s) : 2000 Location : United States (USA)

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300mm DYD2 Tool ID: DYD2 Year(s) : 2005 Location : EUROPE (Western and Northern)

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Cu Film thickness measurement Version: 300 mm Location : AMERICA North (USA-Canada-Mexico)

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You can find used Semiconductor Equipment on Wotol

For second hand Semiconductor Equipment we have Wafer Equipment, Wafer Handler & Robots, CVD Equipment, Wet Bench, Lithography & Photoresist, Plasma Etcher / Asher, Dicer & Scriber, Grinding, Lapping & Polishing, Component Counters/Tapers, Dry Pump, Bonder, Metrology and inspection equipment. The main manufacturers for used Semiconductor Equipment are KLA-Tencor, Plasmatherm, AMAT, TEL, Disco, Karl Suss, Canon, Semitool, Hitachi, Nanometrics, Nikon, Applied Materials, Tegal, Varian.

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