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Used Semiconductor Equipment

3,574 results
1

Manual wafer load substrate bonder Capable of fusion compression bonding Capable of thermal compression bondin Year(s) : 2008 Location : AMERICA North (USA-Canada-Mexico)

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Thin film measurement tool Broadband UV optics Dual beam spectrophotometry Wafer sizes: 100mm, 150mm, and 200m Location : AMERICA North (USA-Canada-Mexico)

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Manual wafer load substrate bonder Set up for fusion compression bonding, thermal compression bonding, and an Location : AMERICA North (USA-Canada-Mexico)

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The Oxford Plasmalab 100 is a modular plasma processing system. It can be configured to carry out Reactive I Location : AMERICA North (USA-Canada-Mexico)

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Wafer sorter for 300mm wafer Version: 300mm De-installed, warehoused. Can be inspected by appointment. 2 port Location : AMERICA North (USA-Canada-Mexico)

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Mask Aligner with CIC1000 lamp housing Version: 200 mm The machine was in working condition up until it was Year(s) : 2019 Location : AMERICA North (USA-Canada-Mexico)

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FEATURES - HYBOND Soft TouchTM energy system. - Front panel ultrasonic test button. - Deep vertical access of Location : AMERICA North (USA-Canada-Mexico)

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552 is a wedge bonder with thermocompression Location : AMERICA North (USA-Canada-Mexico)

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572 is a Vertical Feed Ultrasonic Wedge/ Wire Bonder Location : AMERICA North (USA-Canada-Mexico)

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300mm DYD2 Tool ID: DYD2 Year(s) : 2005 Location : EUROPE (Western and Northern)

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Cu Film thickness measurement Version: 300 mm Location : AMERICA North (USA-Canada-Mexico)

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PVD cluster tool Version: 150 mm De-installed by the OEM . In working condition. Warehoused. Can be inspected Location : AMERICA North (USA-Canada-Mexico)

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- Alignment System MA150e TSA - PC -Aut. Adjustment ( Autoalignment System) Cognex 8100 ( Patmex ) TSA - Lamph Location : EUROPE (Western and Northern)

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Double sided CO2 Laser marking system Brand HGTech Dual Headed system. Mark both sides in a single pass. High Year(s) : 2021 Location : EUROPE (Western and Northern)

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Bonder Location : EUROPE (Western and Northern)

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Max PCB: 510 x 510 mm Year(s) : 2011 Location : AMERICA North (USA-Canada-Mexico)

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Inline AOI 5 Camera Windows 7 DOM: 10/2012 Year(s) : 2012 Location : AMERICA North (USA-Canada-Mexico)

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The S3088-II utilizes high performance Viscom 8M camera technology to meet extreme throughput requirements. Year(s) : 2008 Location : AMERICA North (USA-Canada-Mexico)

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Orthodyne M360C Location : EUROPE (Western and Northern)

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Focused Ion Beam (FIB) system. Location : United States (USA)

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Condition Good Power Requirements 380 V 3 Phase Power Consumption : 17 kw 58 BTU/Hour Exterior Dimensio Year(s) : 1999 Location : EUROPE (Western and Northern)

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Die Bonder Model AD898 Year(s) : 2006 Location : EUROPE (Western and Northern)

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Automated wafer cleaning system 4 robots Condition: Complete like new working condition, only used during Year(s) : 2011 Location : EUROPE (Western and Northern)

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Optical 3D Surface Profiler Manufacturer: Sensofar Model: PLu Neox Optical 3D Surface Profiler with motorized Year(s) : 2012 Location : AMERICA North (USA-Canada-Mexico)

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Vertical Furnace for LPCVD SOD Process Version: 200 mm Vintage: 01.06.2007 Vintage 2007.01 Software OS L Year(s) : 2007 Location : AMERICA North (USA-Canada-Mexico)

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You can find used Semiconductor Equipment on Wotol

For second hand Semiconductor Equipment we have Wafer Equipment, Wafer Handler & Robots, CVD Equipment, Wet Bench, Lithography & Photoresist, Plasma Etcher / Asher, Dicer & Scriber, Grinding, Lapping & Polishing, Component Counters/Tapers, Dry Pump, Bonder, Metrology and inspection equipment. The main manufacturers for used Semiconductor Equipment are KLA-Tencor, Plasmatherm, AMAT, TEL, Disco, Karl Suss, Canon, Semitool, Hitachi, Nanometrics, Nikon, Applied Materials, Tegal, Varian.

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