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Used Semiconductor Equipment

3,630 results
1

Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Number of Cassette Platforms 24 Robot Ma Year(s) : 1999 Location : EUROPE (Western and Northern)

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Top Down Viewing Camera 120VAC 1500W Max Specifications ( See Details above for installed options ) YESTech’s Location : AMERICA North (USA-Canada-Mexico)

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INLINE AOI SYSTEM MODEL VT S500-02 Year(s) : 2018 Location : AMERICA North (USA-Canada-Mexico)

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Shadow Proof 3D Sensor 1D/2D Internal Reader Sigmalink Offline Review Software Vision 3D Program Inspection So Year(s) : 2020 Location : AMERICA North (USA-Canada-Mexico)

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Laser source Year(s) : 2012 Location : AMERICA North (USA-Canada-Mexico)

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Contact Profilometer Version: 150 mm Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)

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System configured for AsP use Version: 100 mm • E475 Stainless Steel High Efficiency Growth Chamber. Year(s) : 2010 Location : AMERICA North (USA-Canada-Mexico)

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Operational Status: Installed / Running Wafer Sizes: 4"/100mm Location : AMERICA North (USA-Canada-Mexico)

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ESEC Die Bonder Accessories Monitors Condition Good Year of Manufacture 2001 Year(s) : 2001 Location : EUROPE (Western and Northern)

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Plasma Etch Wafer Size Range Minimum 150 mm Maximum 150 mm Set Size 150 mm Other Information proc Year(s) : 1995 Location : EUROPE (Western and Northern)

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Wafer Inspection Microscope Model MIS200 Location : EUROPE (Western and Northern)

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VERTICAL FEED, HEATED WORK HOLDERS AND HEATED TRANSDUCER OPTIONS Location : AMERICA North (USA-Canada-Mexico)

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Measurement: Film thickness/Fluorescent X-ray Model XDVN-W Location : ASIA (North East)

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The aluminum or gold wire size it uses is .7-3 mil The weight of this machine is 60 lbs and the size is 12″ W Location : AMERICA North (USA-Canada-Mexico)

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manual wedge bonder Location : AMERICA North (USA-Canada-Mexico)

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MP200 double path tool non copper tool; double path tool delay stage; 6 inch chuck Cooling Water Required Min Year(s) : 2002 Location : EUROPE (Western and Northern)

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Leica INS3300 is the most advanced solution in the production control of 200 mm and 300 mm wafers. This compa Year(s) : 2003 Location : EUROPE (Western and Northern)

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Karl Suss MA8/BA6 Mask Aligner consisting of: - Model: MA8/BA6 - Configured for Topside Alignment (TSA) Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

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Nikon Eclipse L200N Microscope consisting of: - Model: Eclipse L200N - L200N Stand with built in Transformer ( Year(s) : 2017 Location : AMERICA North (USA-Canada-Mexico)

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GROSS LEAK PRESSURE SYSTEM Location : AMERICA North (USA-Canada-Mexico)

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4410 sputtering system 3 DELTA TARGETS CTI CRYOPUMP (REBUILT) WITH COMPRESSOR VACUUM VALVES REBUILT NEW HMI/PL Location : AMERICA North (USA-Canada-Mexico)

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Accessories Monitors Condition Good Year of Manufacture 2010 Year(s) : 2010 Location : EUROPE (Western and Northern)

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Condition Good Exterior Dimensions Width 86.614 in (220.0 cm) Depth 49.213 in (125.0 cm) Height Year(s) : 2015 Location : EUROPE (Western and Northern)

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Working condition before deinstall Location : EUROPE (Western and Northern)

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Veeco Wyko NT3300 Non contact Profilometer Fully Refurbished New PC with latest Wyko software revision running Location : EUROPE (Western and Northern)

Price : On request

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You can find used Semiconductor Equipment on Wotol

For second hand Semiconductor Equipment we have Wafer Equipment, Wafer Handler & Robots, CVD Equipment, Wet Bench, Lithography & Photoresist, Plasma Etcher / Asher, Dicer & Scriber, Grinding, Lapping & Polishing, Component Counters/Tapers, Dry Pump, Bonder, Metrology and inspection equipment. The main manufacturers for used Semiconductor Equipment are KLA-Tencor, Plasmatherm, AMAT, TEL, Disco, Karl Suss, Canon, Semitool, Hitachi, Nanometrics, Nikon, Applied Materials, Tegal, Varian.

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