Used Semiconductor Equipment
3,760 resultsSubcategories
EM343 WAFER SIZE 12 Year(s) : 2007 Location : EUROPE (Western and Northern)
Price : On request
More detailsMaximum Substrate Diameter 6.000 in (15.2 cm) Spindle Type Air Bearings Maximum Spindle Speed Max 40,000 Year(s) : 1994 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsWidth 24.000 in (61.0 cm) Depth 24.000 in (61.0 cm) Height 76.000 in (193.0 cm) Weight 700 lb Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsMicroscope: Quick Vision System Location : ASIA (North East)
Price : On request
More detailsMicroscope Location : ASIA (North East)
Price : On request
More detailsFacilities: 100-240 VAC, 50/60 Hz, 10 amps Dims: 34” x 39” x 17” (864mm x 991mm x 432mm) @ 170 lbs FEATURES: Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsFacilities: Dual voltage 100-200V Dims: 584 x 629 x 849 (WDH in mm) @ 42Kg Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsBond Tester Control Box Includes Control Board and Connecting Cable Condition Excellent Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details8098 Wafer Size: 200mm Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details200 ACU Asher Serial Number: AU6A356AH Wafer Size: 200mm Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details7500 Dicing Saw Wafer Size: 150mm Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsLithius Track 300mm Year(s) : 2006 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsProfiler Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsAOI Serial Number SG51500054 Location : -
Price : On request
More details2006HR Die Bonder Location : EUROPE (Western and Northern)
Price : On request
More details2008HL Die Bonder Location : EUROPE (Western and Northern)
Price : On request
More details2008SC3 Plus Smart Card Die Bonder Location : EUROPE (Western and Northern)
Price : On request
More details2008XP3 Die Bonder Location : EUROPE (Western and Northern)
Price : On request
More detailsWAFER SIZE 6 Year(s) : 1995 Location : EUROPE (Western and Northern)
Price : On request
More details3100 Plus Gold Wire Bonder Location : EUROPE (Western and Northern)
Price : On request
More details6400 Aluminium Wire Bonder Location : EUROPE (Western and Northern)
Price : On request
More detailsChemical vapor deposition 2007 or 2008 Evaporation Pyrolyse Tank dia 700 x670 h Pump edwards em80 Year(s) : 2007 Location : EUROPE (Western and Northern)
Price : On request
More detailsCondition Fair Power Requirements 380 V 3 Phase Other Information Power Consumption : 6,25 kVA Temp Ra Year(s) : 2014 Location : EUROPE (Western and Northern)
Price : On request
More detailsMicrowave Asher Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsWafer Size: 200mm Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsYou can find used Semiconductor Equipment on Wotol
For second hand Semiconductor Equipment we have Wafer Equipment, Wafer Handler & Robots, CVD Equipment, Wet Bench, Lithography & Photoresist, Plasma Etcher / Asher, Dicer & Scriber, Grinding, Lapping & Polishing, Component Counters/Tapers, Dry Pump, Bonder, Metrology and inspection equipment. The main manufacturers for used Semiconductor Equipment are KLA-Tencor, Plasmatherm, AMAT, TEL, Disco, Karl Suss, Canon, Semitool, Hitachi, Nanometrics, Nikon, Applied Materials, Tegal, Varian.