Used Bonder
414 resultsASM AD838 Die Bonder Vintage;2014 Magazine and stack loader input Magazine output 8 inch wafer table and expan Year(s) : 2014 Location : EUROPE (Western and Northern)
Price : On request
More details60° Bondhead; e-box; Belt conveyor; refurbished can demo after order Year(s) : 2012 Location : EUROPE (Western and Northern)
Price : On request
More detailsSUSS MA6 MASK ALIGNER consisting of: - Model: MA6/BA6 - Manufacturer: Suss MicroTec / Karl Suss - Waf Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsEVG 510 Wafer Bonder consisting of: - Model: 510 Wafer Bonder - Manual wafer load substrate bonder - Year(s) : 2019 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsDie Bonder Model AD838 Year(s) : 2013 Location : EUROPE (Western and Northern)
Price : On request
More detailsEpoxy Die Bonder Location : EUROPE (Western and Northern)
Price : On request
More detailsDie Bonder was only used for R&D , Excellent condition. Magazine to Magazine Rotary Bond Head Wafer Mapping 6 Year(s) : 2015 Location : EUROPE (Western and Northern)
Price : On request
More detailsVintage 2000 (2) 2001 2003 Exterior Dimensions Width 74.803 in (190.0 cm) Depth 49.213 in (125.0 cm) Year(s) : 2000, 2001, 2003 Location : EUROPE (Western and Northern)
Price : On request
More detailsAutomatic Epoxy Die Bonders Condition Good Year of Manufacture 2011 Year(s) : 2011 Location : EUROPE (Western and Northern)
Price : On request
More detailsManual Epoxy Die Bonder Model 7201CR-79 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsMicro Point Pro iBond 5000 Deep Access Wedge Bonder Year(s) : 2024 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsF&K Delvotec 5430 Semi-Automatic Wire Bonder Wedge & Ball Bonding Heated Workholder Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsWest Bond 7372B Convertible Epoxy & Eutectic Die Bonder. Simple change of a tool head allows for use as eithe Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsCondition Good Year of Manufacture 2011 Year(s) : 2011 Location : EUROPE (Western and Northern)
Price : On request
More details• Operation: Manual • Optics: Split Field • Lamp: 350 W • System: Tabletop, similar to MJB-3 • Substrate Capac Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• Equipment Type: Wire Bonder • Type: Ball Bonder with Negative EFO • Includes: Heated Work Holder • Includes: Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsCondition Good Year of Manufacture 2008 Year(s) : 2008 Location : EUROPE (Western and Northern)
Price : On request
More detailsCondition Good Year of Manufacture 2011 Year(s) : 2011 Location : EUROPE (Western and Northern)
Price : On request
More detailsCondition Good Year of Manufacture 2010 Year(s) : 2010 Location : EUROPE (Western and Northern)
Price : On request
More detailsCondition Good Year of Manufacture 2011 Year(s) : 2011 Location : EUROPE (Western and Northern)
Price : On request
More detailsWire Bonding Equipment Condition Good Year(s) : 2010 Location : EUROPE (Western and Northern)
Price : On request
More detailsWB_SHINKAWA ACB3000_ACB057 Year of Manufacture 2010 Condition Good Year(s) : 2010 Location : EUROPE (Western and Northern)
Price : On request
More detailsCondition Good Year of Manufacture 2015 Year(s) : 2015 Location : EUROPE (Western and Northern)
Price : On request
More detailsCondition Good Year(s) : 2010 Location : EUROPE (Western and Northern)
Price : On request
More detailsCondition Good Year of Manufacture 2009 Year(s) : 2009 Location : EUROPE (Western and Northern)
Price : On request
More detailsYou can find used Bonder on Wotol
The main manufacturers of Bonder are Esec, ASM, West Bond, K & S, Kulicke and Soffa (K&S), EVG, Orthodyne, KNS, Westbond, Alphasem, Dage, Delvotec, Mech-El, Hesse, Alessi , Benchmark, Cedal, CMI (Coating Measuring Industries), Datacon, Disco, DNS Dpveen, Dynatex, Ewald Instruments,F&K Delvotec, Hesse & Knipps,Hesse, Hughes, Hybond, HyperVision, Karl Suss, Kulicke and Soffa (K&S) , Laurier, Logitech, MBS, MEI, MRSI, Mullen, OAI, Optima, Palomar, Pesl, Research Device Automation, Research Devices, Royce, SEC, Semiconductor Equipment Corporation (SEC), Shinkawa, Suss, TEL, Tosok, TPT, Tresky, Ultron , Unitek .
The main model 2008HS3 Plus, Eagle Express GOCu , DieSeries, 2100 hS, T-3000-FC3 , Delvotec 5610, Royce 550 Die Bonder, 1204W, A7372E, 7374B, 4523, 1204W, 827, 907Series, 1204B, 829Z, 909Series, 20 Wedge, AD896-06, 2200 EVO, Eagle 60, 2200 APM, 5400B, 7400, 7416, 3100, DINP, 3100, Delvotec, Wedge, LAW-820, DBD3550R, UTC1000, M360C, 850TB,7200A, 520, BT, 572-40, DXB, 505Series, SA220, 4000, 572A, 522, 552A 3000, 703, 709/703, 1WBT5, 850Series, 8000, 3088, 2006S, 3018, 4000HS, CP-222, Swissline, 4020Series, 4450, 7200c, 703/709, 454630E-79, 7400B HBSeries OE, 4000, 360C, 20, 6320, 1WBS2, 990, 20R, 2400PC, 7400A, AD809S Series-4000-P, BJ920 M360C, 8000, UH130, 2200, 2100XP, Leadfrme, 3200, 2100FC, 2008, HS3PLUS, 3088CU, AB339, AD898, 898, 2470-V.
HS Code 8486 90 00 for Die Bonder Machine - Parts and Accessories and other machinery from 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays