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Brand: Allwin21 Corp.
Allwin21 Corp. AW-901e Plasma Etch RIE

Wafer Size: 3″ – 6″ Capability
Wafer Loading: 3-axis Robot; Stationary Cassette Plate
Plasma Power: RF 13.56MHz
Type: Parallel/Single Wafer Process; Stand-Alone
Gas Lines: 1-3 Lines

Features:.

PROCESS AND PRODUCTION PROVEN reactor chamber assembly with upper and lower electrode.
Handles 75mm,100mm, 125mm, 150mm Silicon or III-V wafers ,round.
Robotic 3-axis wafer transfer TO PREVENT WAFER BREAKAGE.
4 independent gas line with 4 MFCs (Customized)
Processing of substrate directly on cooled wafer chuck
13.56MHz fully automated RF matching network
ENI ACG-10B 13.56MHz or Equivalent (Water Cooled). Air-Cooled RF Generators are optional.
Accurate, closed-loop pressure control with UPC and MKS Baratron capacitance manometer
Touch screen monitor or LCD Monitor with PC.
New AW-901e Control System from Allwin21 Corp.

Gas flows: settings for up to 4 independent mass flow controller values
RF power: 50 to 1000 watts
Process pressure
Absolute endpoint time
Timed cycles up to 4 hour each
Wafer pins up/down
Optical Endpoint Parameters
Automated calibration of all subsystems
Trouble shooting to subassembly levels
Programmed comprehensive calibration and Built-in diagnostic functions
Recipe creation for full automatic wafer processing
Automatic decline of improper recipes and process data
Multi level pass word protections
Storage of multiple recipes and system functions
Real-Time process data acquisition, display ,analysis
Real-Time graphics display
Process Data and Recipe storage on a hard drive