Oxford Instruments Plasmalab 800 Plus

Large Capacity Open Loaded Plasma Enhanced Chemical Vapor Deposition System.
460mm diameter electrode offers a capacity of up to twelve 4 in. wafers.
Ideally suited for batch PECVD processing where excellent across chamber uniformity
of less than 2 percent is achieved for silicon nitride and silicon dioxide layers.
Configured for 2 in. wafers
18.75 in. top electrode with shower head gas input.
Footprint is kept to a minimum by locating all electronics and
vacuum components within the body of the tool,
mass flow controllers are housed separately in a wall mounted gas pod.
Six MFC gas controllers, previously used gases He, N2, N2O, NH3,
5% SIH4/95% N2, 80% CF4- 20% O2
PC controller provides intuitive user interaction with
the system via advanced graphics and process recipe pages.
Includes vacuum pump and blower package. Mfg. 2009
Software: PC2000 V1.8
Manufacture date 2009
Blower and pump package
208v/3 phase 18amps