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Used Wafer Equipment

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1

Disco DFL7160 Laser saw (DAF type) The DISCO DFL 7160 is a fully automatic laser saw used in the semiconduct Year(s) : 2014 Location : EUROPE (Western and Northern)

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Disco DTG 8460 Taiko Grinder 12" - 3 Chucks - Add on Chiller (DTU 1531), USV, Duct Unit, Vacuum Unit - Cassett Year(s) : 2012 Location : EUROPE (Western and Northern)

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Tencor surface profile Alpha Step 200 233 good condition , fully working and tested. Location : EUROPE (Western and Northern)

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SET Mask Aligner M.A.750 5" Chuck Split field 174 microscope Auto load system Location : EUROPE (Western and Northern)

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Rucker & Kolls Prober 682A 6" wafer prober. 165 Location : EUROPE (Western and Northern)

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Karl Suss Mask aligner MA6 Topside alignment . Currently set for 4" (100mm ) but has 6" (150mm) capability. Su Location : EUROPE (Western and Northern)

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Karl Suss Mask aligner MA 45 just arrived nice clean fully working unit. Currently set for 2"x 2" substrates , Location : EUROPE (Western and Northern)

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Disco Wafer saw DADHT/6 Recently fitted new spindle motor 295 Location : EUROPE (Western and Northern)

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Disco Wafer saw 2H/5LI 5"saw designed for cutting ceramic as well as silicon 294 Location : EUROPE (Western and Northern)

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Canon PLA-501 Aligner Nice clean fully working machine which has had little use. Suitable for 2" - 3" - 4" Location : EUROPE (Western and Northern)

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<b>1x Rucker & Kolls, 682A, Prober Description</b> 6" wafer prober. Location : EUROPE (Western and Northern)

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ELECTROGLAS 4085X 200mm Automated Prober 200mm Temptronic thermal inducing non-contacting Wafer Chuck Temptro Location : EUROPE (Central and Eastern)

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ELECTROGLAS HORIZON 4085X 200mm Automated Prober 200mm Hot Chuck, gold plated Controller RMHN4 Display Contro Location : EUROPE (Central and Eastern)

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SERIAL: 05940331 8" PLATE VOLT: 115 AMP: 4 HZ: 60 USEE 8687 CRATE SIZE: 40X40X42 CRATE WEIGHT: 390 LBS Location : AMERICA North (USA-Canada-Mexico)

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Coat/Develop Cluster Location : AMERICA North (USA-Canada-Mexico)

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Patterned Wafer Surface Inspection Year(s) : 1997 Location : AMERICA North (USA-Canada-Mexico)

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Please visit our website for updated information at www.allwin21.com Updated Brochure in2024:https://allwin21 Year(s) : 2024 Location : AMERICA North (USA-Canada-Mexico)

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Please visit our website for updated information at www.allwin21.com Updated Brochure in2024:https://allwin21 Year(s) : 2024 Location : AMERICA North (USA-Canada-Mexico)

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Please visit our website for updated information at www.allwin21.com Updated Brochure in2024:https://allwin21 Year(s) : 2024 Location : AMERICA North (USA-Canada-Mexico)

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Please visit our website for updated information at www.allwin21.com Updated Brochure in2024:https://allwin21 Year(s) : 2024 Location : AMERICA North (USA-Canada-Mexico)

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Please visit our website for updated information at www.allwin21.com Updated Brochure in2024:https://allwin21 Year(s) : 2024 Location : AMERICA North (USA-Canada-Mexico)

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The spin rinse dryer is used for rinsing and drying substrates. A safety emergency stop for the nitrogen heate Year(s) : 2015 Location : EUROPE (Western and Northern)

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The Spin Rinse Dryer is used for rinsing and drying substrates. Max. size: 8" low profile, NOT Aus on the fro Year(s) : 2017 Location : EUROPE (Western and Northern)

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SussMicrotec Mask Aligner MA 150e Remanufactured Automatic Mask Aligner System, Configuration: Suss MA 100/15 Year(s) : 2010 Location : EUROPE (Western and Northern)

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Description: Exhaust management gas scrubber BOC EDWARDS BOC EDWARDS Longdescription: Equipment Details: Ex Year(s) : 2004 Location : EUROPE (Western and Northern)

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You can find used Wafer Equipment on Wotol

The main manufacturers of Wafer Equipment are KLA-Tencor, Karl Suss, Canon, Electroglas, Suss, Nikon, Semitool, TEL, Tokyo Semitsu Kogaku (TSK), Branson / IPC, MGI, Ultron, EVG, Allwin21, Abm, Accretech, ADE, AG Associates, AIO, Alessi, Applied Materials, ASM, ASML, Asyst Technologies, ATMI, Axcelis, Brooks Automation, Buehler, Cambridge, Cascade, Cascade Microtech, CDE (Creative Design Engineering), CEE, CHA, Control Micro Systems (CMS), Cymer, Dainippon Screen,Dektak, Denton, Disco, DNK, DNS, Dynapert, Dynatex, Electroglass, EV Group, Evergreen, Faith, Fluoroware, Fortrend Engineering, Gasonics, GCA, GSI Lumonics, Hitachi, HTG, IMT, InspecTech, Ionic Systems, Jeol, K & S, Kensington, KLA, Kokusai, LAM, Lam Research, Leica, Lintec, Loomis, Lumonics, Mactronix, Matsushita, Mech-El, Micro Automation, MRC, MTI, Nanometrics, Nitto, OAI, Olympus, Oriel, Oxford, Perkin Elmer, PRI, Prometrix, Recif SA, Rucker & Kolls, Suss MicroTec, SVG, Takatori, Tegal, Tencor, Tropel, Ultracision, Ultratech, Ulvac, Veeco, Verteq, Wentworth, Xynetics

The main model  MPASeries, CDS-650CT, PLA-501F, MA-4100, NSR-1505G4, 1000, Titan II, MA150,  6033, 2029,2020,2025, 6200Series, SM200E, Step 200,UM810, UH-130, UF3000 EX, SFX100, M777, FPA-5500iZa, SR8220-019, Desktop 1, 270 SRD, ST-260, 1600-55, 8100XP, 8100Series, 1H-DX, KP-4200, MA-4201Series, MA-1006, L200,UH130M,DFM-M150, CEE 100, SP323, MJB3Series, JWSSeries, MA6Series, SWC4000, EX-5700, 2001X, MDA-60FA, 680A, 8300, ARM200CF, S-5200, S-4700, AS5000, Axiotron II, INS330, Axiospect 301, SF 600, WaferMark II,3308, MASeries, 20T2/150VPO, 860, 1600-55A, UH 102, 4000, Eureka 450, ETI0392A-6-U, 425130, ETII-6910B-X-V, EET1-0395D-X-U, ETII-6910B-X-V, F-6225, 827, 907, 211,UVSeries, AIT8010, eCD2, 8100XPR, CD-SEMSeries, 8250, PC 4400, 300405, SFS 6420, 6D, MM-Cascade 6100, MJB-55, 179884/ P-2 OPEN FRAME, 8300X, 4500, ATRM-2100, SWC11, MAS-8000,ATM-1100E, 3A, 90, RTP-600xp, UKA-650, SPP8, MP 2300, BH-BHM, 2066,AL100-L8, IDLW8R, REL-4500, IDLW8R, MAS-8000, Fix Load25, UKA-825, SCW111, ATRM-2100D, 4055/2, Optistation 3, REL-4500, ResMap 178, 8097, 1600-55m, LSD 100, DSL 10, H100, RHM-06, 908, UH-130, 600W, 100FX, RS 35, P16+, 8620, MA8/BA8 Gen3, lle-855SS, 85DD, SFS7700, 2300 Versys, ZX-1000, Mark7, S-7800HSA, 5610,ES3, M-GAUGE 200, AITI,SFS7200, THERMA-WAVE OP 2600, MA150, 2115, 9400, NGP80, 620, XRF3640, CTR-200, TREX 610, F-4225, EET10395-4-U, SYO-200SS, MS100, RS-75, 7400/18, 2001X 6, PLA-501FA, PS300 Parametric Serie 12, DX-III, SHS 1000VAC, V300-Si, 12", WM650, AlphaStep 300, SURFSCAN 7700, 903eSeries, F6000QS, SP1 TB1, Nanolab 600, NWL860-TMB-SP, F5, DSS200, RS35C, MX-50, DD-823V-8BL, MicroSense 6300, 2400, 4400,E5200, 8108, 600FA, 40, MRC 603, 7700, VersaPort 2200, R-3, SSEC M10, ST-270 SRD, L3510, HTC 8020, Lumonics III, 1800-6AR, HTC 4000, SSW-60A-AR, 1034X, WST 306, ST-860, KIS 2000, L3510E, 9350, PSM 6, 80B, RS-35, DR-8500 II, 301, VLR RIE LM/TM, 20T2/150VPO, 1034 XA – 6, 4085XSeries, 682A, 500R 120-1007, E8025S, 100 RIE, M6000L, EV CS50, 150, RC8, ATM-105-1-S-CE-S293, MPC3000, DMI4000B, 5100, F5x, P-10, LP-200H, F200, CMS1030, CW1002-6200RW, 8860, APM90A, 3001X, APM5000, 880

HS Code 8486 10 10 for Apparatus for rapid heating of semiconductor wafers. 
HS Code 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devicesde8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices

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