PVA TEPLA 660

PVA TEPLA 660 Microwave Plasma Cleaning System.
Low-pressure microwave plasma systems for
cleaning advanced chip packages prior to die attach,
wire bond and encapsulation.
The electrode-free energy feeding is the key factor for
processing substrates in their original, unslotted magazines.
Microwaves of 2.45 GHz are simply applied through a window in
the wall of the vacuum chamber producing a
largely extended plasma there.
Unslotted magazines are processed in a downstream configuration,
slotted magazines are more properly placed on a rotating platform.
Any size of magazine can be processed. Due to the use of
microwaves the plasma systems 400 and 660 provide for
fast and damage-free plasma processing.
In these plasma systems the plasma cleaning effect is
based on chemical reactions of reactive plasma particles (radicals)
guided through the substrate carriers. The systems are easy to
operate and feature simplest loading and unloading, manually as
well as automatically. System software complies with standards in
semiconductor industries.
Currently configured with three gas inputs plus purge gas.
Chamber size 15" x 15" x 15".
System comes with rotary vane vacuum pump.