Used Bonder
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2008HS3 Plus Die Bonder Location : EUROPE (Western and Northern)
Price : On request
More detailsDie Sorter Bonder Location : EUROPE (Western and Northern)
Price : On request
More detailsASM AD9012 FLIPCHIP 12″ D/A 10 Sets Available Year(s) : 2007 Location : EUROPE (Western and Northern)
Price : On request
More detailsThis system is equipped with handlers but was being used in a manual / prototype fashion previously. Unit is Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsBrand: Palomar Palomar Hughes 2460-V Automatic Thermosonic Hybrid Gold Ball Bonder With heated work stage, M Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsali: Mask Aligner/4in. Location : ASIA (North East)
Price : On request
More detailsFlip Chip Bonder Maker BESI Year(s) : 2022 Location : ASIA (North East)
Price : On request
More detailsFli: Micro bonder/8in Location : ASIA (North East)
Price : On request
More detailsWire Bonder Year(s) : 2021 Location : ASIA (North East)
Price : On request
More detailsWIRE PULL TEST MACHINE Location : ASIA (North East)
Price : On request
More detailsFeatures: • Wafer Capacity: up to 12 inch (300 mm) wafers or film frames • Pneumatic Ram: speed controlled • R Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsSUSS MA200e MASK ALIGNER consisting of: - Model: MA200E - Windows based - Topside Alignment (TSA) - P Year(s) : 2006 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsKarl Suss MA150 Mask Aligner consisting of: - Model: MA-150e - Topside Alignment (TSA) - Automatic Ma Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsSUSS MICROTEC BA8 BOND ALIGNER (Gen 3) consisting of: - Manufacture: Suss MicroTec - Model: BA8 Gen3 - V Year(s) : 2017 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsPC, Monitor, Keyboard, Mouse 1000W Lamphouse CIC1200 Power Supply Isolation Table Chuck and Maskholder for 8 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsF&K Delvotec 5430 Semi-Automatic Wire Bonder Wedge & Ball Bonding Heated Workholder Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsWest Bond 7372B Convertible Epoxy & Eutectic Die Bonder. Simple change of a tool head allows for use as eithe Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsK&S 4522 Manual Gold Ball Wire Bonder With heated work holder. For process development, production, research Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsK&S 4524 Manual Gold Ball Bonder. Versatile production capabilities for bonding applications from simple to Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsK&S 4524AD Programmable Digital Ball Bonder. Manages 200 programs with up to six channels per program. Motor Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsWest Bond 4KEX Semi-Automatic, Motorized Y/Z Axes, Wedge-Wedge, Ball-Wedge Convertible Large Substrate Wire B Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsEVG 520 WAFER BONDER consisting of: - Model: EVG 520 - Manual wafer load substrate bonder - Capable of fusion Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsProvides the High Yields and Excellent Repeatability Needed for All Gold Ball Bonding Applications Including: Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsK&S 4524D Programmable Digital Ball Bonder. Manages 200 programs with up to six channels per program. Digita Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsWest Bond 353637E-90 Automatic, Gantry, Large Area, Triple-Convertible Wire Bonder. Currently configured for Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsYou can find used Bonder on Wotol
The main manufacturers of Bonder are Esec, ASM, West Bond, K & S, Kulicke and Soffa (K&S), EVG, Orthodyne, KNS, Westbond, Alphasem, Dage, Delvotec, Mech-El, Hesse, Alessi , Benchmark, Cedal, CMI (Coating Measuring Industries), Datacon, Disco, DNS Dpveen, Dynatex, Ewald Instruments,F&K Delvotec, Hesse & Knipps,Hesse, Hughes, Hybond, HyperVision, Karl Suss, Kulicke and Soffa (K&S) , Laurier, Logitech, MBS, MEI, MRSI, Mullen, OAI, Optima, Palomar, Pesl, Research Device Automation, Research Devices, Royce, SEC, Semiconductor Equipment Corporation (SEC), Shinkawa, Suss, TEL, Tosok, TPT, Tresky, Ultron , Unitek .
The main model 2008HS3 Plus, Eagle Express GOCu , DieSeries, 2100 hS, T-3000-FC3 , Delvotec 5610, Royce 550 Die Bonder, 1204W, A7372E, 7374B, 4523, 1204W, 827, 907Series, 1204B, 829Z, 909Series, 20 Wedge, AD896-06, 2200 EVO, Eagle 60, 2200 APM, 5400B, 7400, 7416, 3100, DINP, 3100, Delvotec, Wedge, LAW-820, DBD3550R, UTC1000, M360C, 850TB,7200A, 520, BT, 572-40, DXB, 505Series, SA220, 4000, 572A, 522, 552A 3000, 703, 709/703, 1WBT5, 850Series, 8000, 3088, 2006S, 3018, 4000HS, CP-222, Swissline, 4020Series, 4450, 7200c, 703/709, 454630E-79, 7400B HBSeries OE, 4000, 360C, 20, 6320, 1WBS2, 990, 20R, 2400PC, 7400A, AD809S Series-4000-P, BJ920 M360C, 8000, UH130, 2200, 2100XP, Leadfrme, 3200, 2100FC, 2008, HS3PLUS, 3088CU, AB339, AD898, 898, 2470-V.
HS Code 8486 90 00 for Die Bonder Machine - Parts and Accessories and other machinery from 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays