Used Semiconductor and PCB Manufacturing
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7 sets ASM Harrier Bonders Vintage 2009~2010 Working condition Year(s) : 2009, 2010 Location : EUROPE (Western and Northern)
Price : On request
More detailsThis West-Bond 545657B is a Semi-Automatic Three-Way Convertible 45° Wire Feed Wedge, 90° Wire & Ribbon Feed Location : EUROPE (Western and Northern)
Price : On request
More detailsDie Bonder Model AD809M-06 Year(s) : 2002 Location : EUROPE (Western and Northern)
Price : On request
More detailsCVD: MOCVD/6in. Year(s) : 2023 Location : ASIA (North East)
Price : On request
More detailsCVD: MOCVD Year(s) : 2012 Location : ASIA (North East)
Price : On request
More detailsDetails Hawkeye 1700 Camera Deposit Verification HawkEye Bridging Vison Plus Tool Deviation Monitoring Specif Year(s) : 2012 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsVintage : APR 2010 120/208V 3 Phase 15" Max Board Width Specifications ( See Details above for installed opti Year(s) : 2010 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsRight to Left Board Flow 11" Max Board Width 3 Magazine Capacity Specifications ( See Details above for insta Year(s) : 2017 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsProvides the High Yields and Excellent Repeatability Needed for All Gold Ball Bonding Applications Including: Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsPlasmatherm SLR-720/720 Dual Chamber RIE Reactive Ion Etch System. PC controller with graphical user interfac Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsPlasmatherm SLR ICP Shuttle Lock ICP Inductively Coupled Plasma Etch System. PC controller. Vacuum load loc Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsPlacement Speed: Rated up to ~14,000 CPH (Topaz‑X) Head Configuration: Single beam with 4 “flying nozzle chan Location : EUROPE (Western and Northern)
Price : On request
More detailsHeads 8 Super‑Fine Throughput ~11.6k CPH (4‑head), ~17.7k CPH (8‑head) Placement accuracy (3σ) 40–50 µm Feeder Year(s) : 2006, 2008 Location : EUROPE (Western and Northern)
Price : On request
More detailsTechnical Specifications (approx.): Max PCB Size: ~20 x 20 inches (508 x 508 mm) Alignment Accuracy: ±12.5 µm Location : EUROPE (Western and Northern)
Price : On request
More detailsIncludes: FINEPLACER lambda Bonding force module FD3 Chip heating module Optional Dispensing Module FG3 WinFli Year(s) : 2017 Location : EUROPE (Western and Northern)
Price : On request
More detailsThis West-Bond 7372E Convertible Epoxy / Eutectic Die Bonder looks to be in good cosmetic condition, showing Location : EUROPE (Western and Northern)
Price : On request
More detailsASM AD898 die bonder, 2 sets ASM AD898 for sale Ex works China , both vintage 2006, Can Trial Run. Year(s) : 2002 Location : EUROPE (Western and Northern)
Price : On request
More detailsChip mounter Year(s) : 2011 Location : ASIA (North East)
Price : On request
More detailsChip Mounter/Flow: L Location : ASIA (North East)
Price : On request
More detailschip: Irregular Component mounter Location : ASIA (North East)
Price : On request
More detailsNikon Eclipse L200D Nomarski 8" Wafer Inspection Microscope with Camera and Measuring Software. Includes a S Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsK&S 4524D Programmable Digital Ball Bonder. Manages 200 programs with up to six channels per program. Digita Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsWest Bond 353637E-90 Automatic, Gantry, Large Area, Triple-Convertible Wire Bonder. Currently configured for Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsWafer Size Range Minimum 200 mm Set Size 200 mm Power Requirements 208 V 50.0 A 50/60 Hz Year(s) : 1994 Location : EUROPE (Western and Northern)
Price : On request
More detailsWafer Size Range Set Size 200 mm Power Requirements 208 V 80.0 A 50/60 Hz 3 Phase CE Marked Y Year(s) : 1999 Location : EUROPE (Western and Northern)
Price : On request
More detailsUsed Semiconductor and PCB Manufacturing for sale
You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).
Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.
Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.
This industry is largely located in Asia and expecially in China.
The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES)
The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14