Used Semiconductor and PCB Manufacturing
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MFG by EUNIL Co. 12.5" Magazine Width 110V Specifications ( See Details above for installed options ) Promati Year(s) : 2004 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsVintage : FEB 2011 Details Model: TEX Includes (2) Tray Magazines 220V Specifications ( See Details above fo Year(s) : 2011 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsVintage : MAR 2015 Details Left to Right Board Flow Edge Rail Only Specifications ( See Details above for in Year(s) : 2015 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsFlying Probe Tester Year(s) : 2022 Location : ASIA (North East)
Price : On request
More detailsinsp: Liquid-Particle Counter Location : ASIA (North East)
Price : On request
More details• Resolution: 3 nm at 30 kV • Magnification: Up to 300,000× • Stage: 5-axis motorized • Sample Size: Supports Year(s) : 2015 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details Wafer Diameter Maximum 12" (300 mm) Wafer XY Table Travel (13” x 13”) 334 x 334mm Die Size (10 x 10 mil Year(s) : 2004 Location : EUROPE (Western and Northern)
Price : On request
More detailsStill inside crates Year(s) : 2011 Location : EUROPE (Western and Northern)
Price : On request
More detailsProcess: Die Attach Condition: Working Year(s) : 2010 Location : EUROPE (Western and Northern)
Price : On request
More detailsReflow Oven Year(s) : 2003 Location : ASIA (North East)
Price : On request
More detailsReflow Oven Year(s) : 2005 Location : ASIA (North East)
Price : On request
More detailsReflow oven Year(s) : 2008 Location : ASIA (North East)
Price : On request
More detailsInsertion Machine Model MultiSert Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsPlasmatherm Versaline VLN ICP Etcher consisting of: - Manual Load Lock for Single or Multiple Wafers - Si Year(s) : 2012 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsDie Bonder Model AD 838 Year(s) : 2013 Location : EUROPE (Western and Northern)
Price : On request
More detailsESEC 2100 FC HS Die Bonder De-installed. It should be complete, so they must go by the photos. Year(s) : 2017 Location : EUROPE (Western and Northern)
Price : On request
More details Wafer Diameter Maximum 12" (300 mm) Wafer XY Table Travel (13” x 13”) 334 x 334mm Die Size (10 x 10 mil Year(s) : 2003 Location : EUROPE (Western and Northern)
Price : On request
More detailsChip mounter Year(s) : 2009 Location : ASIA (North East)
Price : On request
More detailsChip mounter Year(s) : 2010 Location : ASIA (North East)
Price : On request
More detailsStepper/6in. Location : ASIA (North East)
Price : On request
More details• Vacuum Units: 1 (second unit optional) • Press Capacity: 60 tons • Stroke Count: 62,133 • Features: Alarm & Year(s) : 2003 Location : EUROPE (Western and Northern)
Price : On request
More details• Equipment Type: Furnace • System Type: Infrared vacuum solder reflow • Pump: Includes turbo pump option • Up Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsWet process machine Location : EUROPE (Western and Northern)
Price : On request
More details• Application: Final-stage polishing of hard materials (sapphire, SiC, GaN) • Down-force: High levels applied Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• PCB Track Width: Up to 100 μm on FR4 18/18 Cu material • Rotation Speed: 100,000 rpm • Resolution: 0.5 μm • Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsUsed Semiconductor and PCB Manufacturing for sale
You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).
Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.
Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.
This industry is largely located in Asia and expecially in China.
The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES)
The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14