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Used Semiconductor and PCB Manufacturing

9,133 results
1

TPS/Blue M HS-362-E Oven (with TPS HS-362-E) Thermal Product solutions Temp range: 25degC to 150degC Shelve Location : AMERICA North (USA-Canada-Mexico)

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SSEC 3302 Single Wafer Chemical Etch Processor. Two wafer processing modules, acid processing. Stainless ste Location : AMERICA North (USA-Canada-Mexico)

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Brand Integrated Solutions Integrated Solutions OPTITRAC 6" Photoresist Developer Track. Developer track is cu Location : AMERICA North (USA-Canada-Mexico)

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West Bond 4KEX Semi-Automatic, Motorized Y/Z Axes, Wedge-Wedge, Ball-Wedge Convertible Large Substrate Wire B Location : AMERICA North (USA-Canada-Mexico)

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EVG 520 WAFER BONDER consisting of: - Model: EVG 520 - Manual wafer load substrate bonder - Capable of fusion Location : AMERICA North (USA-Canada-Mexico)

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Temp Range: -70 to +170 Celsius 208V Specifications ( See Details above for installed options ) Cincinnati Su Location : AMERICA North (USA-Canada-Mexico)

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Vintage : JUL 2024 UV Curing Oven Brand New - Never Used - 2024 3-Phase ; 208V Specifications ( See Details a Year(s) : 2024 Location : AMERICA North (USA-Canada-Mexico)

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Vintage : DEC 2000 14" Max Board Width Left Hand Turn Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)

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• Type: 4-opening hot oil press • Heating: Oil heater powered by electricity • Control: Includes control cabin Year(s) : 1998 Location : EUROPE (Western and Northern)

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• Equipment Type: Plasma Cleaner / Plasma Etcher • Power: 750 W • Gas Capability: 3 gases • Chamber Size: 10" Location : AMERICA North (USA-Canada-Mexico)

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• Chuck Size: Configured with 4" chuck • Wafer Capacity: 6" capable Location : AMERICA North (USA-Canada-Mexico)

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4 opening hot oil press, oil heater powered by electricity, heating plate size 750mm x 620mm. Not included: lo Year(s) : 2003 Location : EUROPE (Western and Northern)

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A MXP ETCH B MXP ETCH C MXP ETCH Good Condition Year(s) : 1997 Location : EUROPE (Western and Northern)

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Type: ICP HR Etch System Wafer Size: 8" Location : EUROPE (Western and Northern)

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Dual etch chamber system with handler Model 602E Year(s) : 2002 Location : EUROPE (Western and Northern)

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Function: Loads PCBs onto production line from magazines or stacks Use: Simplifies double-sided board assembly Location : AMERICA North (USA-Canada-Mexico)

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Final Specifications – Your Configuration Dimensions & Weight Machine size (L × W × H): 3,540 × 1,455 × 1,665  Location : EUROPE (Western and Northern)

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Wire Bonder Model Eagle 60 Year(s) : 2007 Location : EUROPE (Western and Northern)

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Includes Hesse DA 04 051 Deep Access Bondhead & Light Tower; Number of Bonds Approx 37,054,610; Dimensions o Year(s) : 2009 Location : EUROPE (Western and Northern)

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A robust, mid-to-high volume SMT reflow soldering system designed for efficient and precise PCB assembly, sup Location : EUROPE (Western and Northern)

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chi: Pick and Place machine Year(s) : 2017 Location : ASIA (North East)

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Dispenser Year(s) : 2006 Location : ASIA (North East)

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Insp: X-Ray Inspection System Year(s) : 2009 Location : ASIA (North East)

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• Fully automatic grinding-polishing system • Capacity: Up to 6 samples • Operation: Fully automated, no conti Location : AMERICA North (USA-Canada-Mexico)

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• Max Temperature: 1700°C • Heating Element: Molybdenum disilicide • Work Tube Compatibility: RCA (recrystalli Location : AMERICA North (USA-Canada-Mexico)

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Used Semiconductor and PCB Manufacturing for sale

You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).

Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.

Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.

This industry is largely located in Asia and expecially in China.

The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES) 

The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14

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