Used Semiconductor and PCB Manufacturing
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• Internal Dimensions: 14 x 14 x 14" • Cooling Method: LN₂ cooled • Temperature Range: -75°C to +200°C • Contr Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• Type: Mask aligner • Power Supply: 1000 W • Resolution: 1 micron on 6″ wafers • Microscope: Split-field type Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details-70 TO 200 DEG C, DIGITAL R/O. Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details300mm WAFER HOLDS 1 WAFER, WITH AE 1000W POWER SUPPLY Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• Wafer Capacity: 1 x 200mm wafer • Power Supply: AE 1000W Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• Operation: Manual • Optics: Split Field • Lamp: 350 W • System: Tabletop, similar to MJB-3 • Substrate Capac Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• Equipment Type: Wire Bonder • Type: Ball Bonder with Negative EFO • Includes: Heated Work Holder • Includes: Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• Equipment Type: Plasma Etcher/Asher • Upgrade: New touch screen controls (covered by 1-year warranty) • Capa Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• Equipment Type: Plasma Cleaner / Plasma Etcher • Power: 750 W • Gas Capability: 3 gases • Chamber Size: 10" Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• Chuck Size: Configured with 4" chuck • Wafer Capacity: 6" capable Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsBREAKER SCRIBER (NEW TOUCH SCREEN CONTROLS Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsvertical feed ultrasonic wedge bonder. Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• Type: Wire Bonder • Bonding Type: Ball bonder • Optics: Includes stereo zoom optics • Optics Option: Upgrade Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• Type: Wire Bonder • Feed Type: Vertical feed • Options: Heated work holders available • Options: Heated tran Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsUp to 225lbs of force (1000 newtons) Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsw/200 gram head with IEEE computer interface Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• Type: Manual probe station • Optics: B&L stereo zoom 4 • Optional upgrade: Zoom 5 (+$100), Zoom 7 (+$400) • Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsWITH NEW ELECTRONICS (1″ TO 6″ WAFERS) Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• Wafer size: 4″ • Optics: Mitutoyo high-power microscope with Microzoom optics • Objectives: 2 included • Chu Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• Equipment type: Prober • Condition: Refurbished Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• Equipment type: Prober • Travel: 6″ travel • Stage: Motorized XY stage • Optics: B&L Stereo Zoom 4 • Steppin Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• Equipment type: Prober • Wafer capacity: For 4″ wafers or smaller • Optics options: Stereo Zoom 4, 5, 6, or Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details4 Dimensions 4 Point Probe • Equipment type: Prober • Wafer capacity: Up to 8″ wafers • Probe type: 4-point pr Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• Type: Epoxy die bonder • Display: LCD • Optics: Stereo zoom optics • Function: Epoxy dispense • Function: Ro Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details4 NEW COLOR VIDEO CAMERAS WITH CROSS HAIRS XY MICROMETERS ON BOTTOM VIDEO CAMERAS DUAL WINDOWS IN CHUCK FOR 4″ Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsUsed Semiconductor and PCB Manufacturing for sale
You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).
Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.
Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.
This industry is largely located in Asia and expecially in China.
The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES)
The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14