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Used Semiconductor and PCB Manufacturing

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ID 16″ W X 12″H X 11″ deep Refrigerated, NO LN2 Required, 115V -20 to 93 DEGC 20 to 98% humidity Location : AMERICA North (USA-Canada-Mexico)

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PROGRAMMABLE PULL TESTER LCD READOUT/MENUS STEREO ZOOM OPTICS Location : AMERICA North (USA-Canada-Mexico)

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ID 19.7 X 23.6 X 29.5” TALL 500X600X750mm TALL -70 TO 150 DEG C Location : AMERICA North (USA-Canada-Mexico)

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ultrasonic wedge bonder is a simple yet very efficient semi-automatic bonder Location : AMERICA North (USA-Canada-Mexico)

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Motorized top brander. Location : AMERICA North (USA-Canada-Mexico)

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4523 Wedge Bonder Calibrated Stereo Zoom Optics Included Auto Tune Ultrasonic Generator. Location : AMERICA North (USA-Canada-Mexico)

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mask aligner exposes up to 3″ wafers Includes split field optics Location : AMERICA North (USA-Canada-Mexico)

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Ma 6 mask aligner upgraded 1000 watt power supply 1 micron resolution on 6″ wafers Location : AMERICA North (USA-Canada-Mexico)

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Includes stereo zoom optics Ultrasonic generator And heated workholder Manual z leve New hmi touch screen logi Location : AMERICA North (USA-Canada-Mexico)

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1204B BALL BONDER INCLUDES STEREO ZOOM OPTICS ULTRASONIC GENERATOR AND HEATED WORKHOLDER MANUAL Z LEVER NEW HM Location : AMERICA North (USA-Canada-Mexico)

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200mm Clamshell Diffusion Furnace 3 zone Location : AMERICA North (USA-Canada-Mexico)

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The MEl 829Z is a thermosonic ball bonder with manual Z lever and heated work holder. Location : AMERICA North (USA-Canada-Mexico)

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Mask Aligner With 150mm Backside Chuck Cassette to Cassette 1000 Watt Light Source Location : AMERICA North (USA-Canada-Mexico)

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10″ COLLIMATED LENS FOR UP TO 6X6″ SQUARES OR 200mm WAFERS DUAL VIDEO CAMERAS ABOVE AND BELOW MASK 500 WATT P Location : AMERICA North (USA-Canada-Mexico)

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FEATURES - HYBOND Soft TouchTM energy system. - Front panel ultrasonic test button. - Deep vertical access of Location : AMERICA North (USA-Canada-Mexico)

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552 is a wedge bonder with thermocompression Location : AMERICA North (USA-Canada-Mexico)

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572 is a Vertical Feed Ultrasonic Wedge/ Wire Bonder Location : AMERICA North (USA-Canada-Mexico)

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50WS welder has a 50 WATT second capacitive discharge. Location : AMERICA North (USA-Canada-Mexico)

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welder has a heavy duty weld head Location : AMERICA North (USA-Canada-Mexico)

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HTT-550 welder has a solder reflow system. Includes VTA66 head and TEM calibrator. Location : AMERICA North (USA-Canada-Mexico)

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The Model 572 sets the industry standard for ease of operation and maintenance. Front panel operator controls Location : AMERICA North (USA-Canada-Mexico)

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HYBOND’s Model 616 ultrasonic single channel peg bonder has been designed to perform ultrasonic attachment of Location : AMERICA North (USA-Canada-Mexico)

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18″ X 30″ HIGH S/S BELL JAR INFICON IC-6000 THICKNESS MONITOR AUTOTECH II AUTOMATIC/MANUAL VALVING ION/DUAL TC Location : AMERICA North (USA-Canada-Mexico)

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The K&S 4123 is a manual wedge bonder that comes with stereo zoom optics. Upgrade to heated work holder. Location : AMERICA North (USA-Canada-Mexico)

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Rebuilt Vacuum Valves Rebuilt Vacuum Pump Rebuilt CTI Cryopump New touch screen valve controller 30 day warran Location : AMERICA North (USA-Canada-Mexico)

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Used Semiconductor and PCB Manufacturing for sale

You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).

Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.

Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.

This industry is largely located in Asia and expecially in China.

The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES) 

The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14

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