Used Semiconductor and PCB Manufacturing
9,204 resultsFind by category
Fume hood Year(s) : 1989 Location : ASIA (North East)
Price : On request
More detailsWafer Size 4 Year(s) : 2012 Location : ASIA (North East)
Price : On request
More detailsDICING SAW WITH SPLIT FIELD MICROSCOPE 6″ CAPABILITY Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsDICING SAW, 6X12″ CUTTING AREAIDEAL FOR CUTTING HARD MATERIALS Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsWAFER BONDER, BONDS RUBBER DISC TO WAFERS UP TO 6″ PRIOR TO DICING, SCRIBING Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsBT 175 BUBBLE TESTER Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsGOLD TIN REFLOW SYSTEM Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsSpecifications: BOARD HANDLING Maximum Board Size (X x Y) 558 mm x 508 mm or (22” x 20”) Minimum Board Size Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsFeatures: • High Efficiency Preheater: 16" x 16" (5000 watts), 2-zone • Board Size: 18" x 24" • Top/Bottom Cle Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsFeatures: Inline model is SMEMA compatible preheat 3 Pump Stations 24"x24" Work Surface (Max Year(s) : 2017 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsMaximum Board Size: 18” x 22” (458mm x 560mm) Minimum Component Size: 0.010” (0.25mm) 1.6 kW Focused Convectio Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsSPECS: I.D. 40"W X 40"D X 36"H O.D. 71"W X 54"D X 94"H Temperature Range: -70 to +170 Deg. C - LN2 Cooled Watl Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsSPECS: I.D. 16"W X 11"D X 12"H O.D. 22"W X 26"D X 61"H Temperature Range: -75 to +200 Deg. C - Air Cooled Has Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsStoron pendulum impact test system ○Main specifications ・Hammer energy range: 0.5-25J (0.37-18.4ft-lbs) *Up to Year(s) : 2017 Location : ASIA (North East)
Price : On request
More detailsNordson select cure uv conformal coat curing oven with 6 inch cure width. Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsLaboratory ovens, fresh-air with explosion protect Location : EUROPE (Western and Northern)
Price : On request
More detailseS32 e-beam wafer inspection 200mm Condition Fair Serial Number(s) 2032 Year(s) : 2006 Location : EUROPE (Western and Northern)
Price : On request
More detailsSerial #: E2000-870241 SMEMA Compliant Volts: 110v Phase: 1 Amps: 8 Hertz: 60 Board Flow Direction: Left to Ri Year(s) : 2012 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsDeep access vertical feed wedge bonder (bonds gold wire, gold ribbon or aluminum wire)20220610 152426 Includes Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsVERTICAL FEED WEDGE BONDER TRUE VERTICAL MOVEMENT DEEP ACCESSG20220214 143050 copy EXTENDED TRANSDUCER LARGE X Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsScreen Printers Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsWafer Size 8" Tool's Condition Refurbishing Step height: Nanometers to 1000µ;m Step height repeatability : 4 Year(s) : 2017 Location : ASIA (North East)
Price : On request
More details6×6″ print area, manual load, automatic shuttle print Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsWafer Size 8" Vintage 2012-3 Tool's Condition Refurbishing The KLA-Tencor P-16+ Profiler is a highly sensiti Year(s) : 2012 Location : ASIA (North East)
Price : On request
More detailsModel Dimension 7000 Wafer Size 8" Vintage 1996-3 Year(s) : 1996 Location : ASIA (North East)
Price : On request
More detailsUsed Semiconductor and PCB Manufacturing for sale
You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).
Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.
Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.
This industry is largely located in Asia and expecially in China.
The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES)
The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14