Used Semiconductor and PCB Manufacturing
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Temp Range: -70 to +170 Celsius 208V Specifications ( See Details above for installed options ) Cincinnati Su Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsVintage : DEC 2000 14" Max Board Width Left Hand Turn Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• Type: 4-opening hot oil press • Heating: Oil heater powered by electricity • Control: Includes control cabin Year(s) : 1998 Location : EUROPE (Western and Northern)
Price : On request
More details• Equipment Type: Plasma Cleaner / Plasma Etcher • Power: 750 W • Gas Capability: 3 gases • Chamber Size: 10" Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• Chuck Size: Configured with 4" chuck • Wafer Capacity: 6" capable Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details4 opening hot oil press, oil heater powered by electricity, heating plate size 750mm x 620mm. Not included: lo Year(s) : 2003 Location : EUROPE (Western and Northern)
Price : On request
More detailsA MXP ETCH B MXP ETCH C MXP ETCH Good Condition Year(s) : 1997 Location : EUROPE (Western and Northern)
Price : On request
More detailsType: ICP HR Etch System Wafer Size: 8" Location : EUROPE (Western and Northern)
Price : On request
More detailsDual etch chamber system with handler Model 602E Year(s) : 2002 Location : EUROPE (Western and Northern)
Price : On request
More detailsFunction: Loads PCBs onto production line from magazines or stacks Use: Simplifies double-sided board assembly Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsFinal Specifications – Your Configuration Dimensions & Weight Machine size (L × W × H): 3,540 × 1,455 × 1,665 Location : EUROPE (Western and Northern)
Price : On request
More detailsWire Bonder Model Eagle 60 Year(s) : 2007 Location : EUROPE (Western and Northern)
Price : On request
More detailsIncludes Hesse DA 04 051 Deep Access Bondhead & Light Tower; Number of Bonds Approx 37,054,610; Dimensions o Year(s) : 2009 Location : EUROPE (Western and Northern)
Price : On request
More detailsA robust, mid-to-high volume SMT reflow soldering system designed for efficient and precise PCB assembly, sup Location : EUROPE (Western and Northern)
Price : On request
More detailschi: Pick and Place machine Year(s) : 2017 Location : ASIA (North East)
Price : On request
More detailsDispenser Year(s) : 2006 Location : ASIA (North East)
Price : On request
More detailsInsp: X-Ray Inspection System Year(s) : 2009 Location : ASIA (North East)
Price : On request
More details• Fully automatic grinding-polishing system • Capacity: Up to 6 samples • Operation: Fully automated, no conti Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• Max Temperature: 1700°C • Heating Element: Molybdenum disilicide • Work Tube Compatibility: RCA (recrystalli Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details7 sets ASM Harrier Bonders Vintage 2009~2010 Working condition Year(s) : 2009, 2010 Location : EUROPE (Western and Northern)
Price : On request
More detailsThis West-Bond 545657B is a Semi-Automatic Three-Way Convertible 45° Wire Feed Wedge, 90° Wire & Ribbon Feed Location : EUROPE (Western and Northern)
Price : On request
More detailsDie Bonder Model AD809M-06 Year(s) : 2002 Location : EUROPE (Western and Northern)
Price : On request
More detailsCVD: MOCVD/6in. Year(s) : 2023 Location : ASIA (North East)
Price : On request
More detailsCVD: MOCVD Year(s) : 2012 Location : ASIA (North East)
Price : On request
More detailsDetails Hawkeye 1700 Camera Deposit Verification HawkEye Bridging Vison Plus Tool Deviation Monitoring Specif Year(s) : 2012 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsUsed Semiconductor and PCB Manufacturing for sale
You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).
Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.
Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.
This industry is largely located in Asia and expecially in China.
The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES)
The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14