Used Semiconductor and PCB Manufacturing

Vintage : APR 2010 120/208V 3 Phase 15" Max Board Width Specifications ( See Details above for installed opti Year(s) : 2010 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Right to Left Board Flow 11" Max Board Width 3 Magazine Capacity Specifications ( See Details above for insta Year(s) : 2017 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Provides the High Yields and Excellent Repeatability Needed for All Gold Ball Bonding Applications Including: Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Plasmatherm SLR-720/720 Dual Chamber RIE Reactive Ion Etch System. PC controller with graphical user interfac Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Plasmatherm SLR ICP Shuttle Lock ICP Inductively Coupled Plasma Etch System. PC controller. Vacuum load loc Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Placement Speed: Rated up to ~14,000 CPH (Topaz‑X) Head Configuration: Single beam with 4 “flying nozzle chan Location : EUROPE (Western and Northern)

Price : On request

Heads 8 Super‑Fine Throughput ~11.6k CPH (4‑head), ~17.7k CPH (8‑head) Placement accuracy (3σ) 40–50 µm Feeder Year(s) : 2006, 2008 Location : EUROPE (Western and Northern)

Price : On request

Technical Specifications (approx.): Max PCB Size: ~20 x 20 inches (508 x 508 mm) Alignment Accuracy: ±12.5 µm Location : EUROPE (Western and Northern)

Price : On request

Includes: FINEPLACER lambda Bonding force module FD3 Chip heating module Optional Dispensing Module FG3 WinFli Year(s) : 2017 Location : EUROPE (Western and Northern)

Price : On request

ASM AD898 die bonder, 2 sets ASM AD898 for sale Ex works China , both vintage 2006, Can Trial Run. Year(s) : 2002 Location : EUROPE (Western and Northern)

Price : On request

Chip mounter Year(s) : 2011 Location : ASIA (North East)

Price : On request

Chip Mounter/Flow: L Location : ASIA (North East)

Price : On request

chip: Irregular Component mounter Location : ASIA (North East)

Price : On request

Nikon Eclipse L200D Nomarski 8" Wafer Inspection Microscope with Camera and Measuring Software. Includes a S Location : AMERICA North (USA-Canada-Mexico)

Price : On request

K&S 4524D Programmable Digital Ball Bonder. Manages 200 programs with up to six channels per program. Digita Location : AMERICA North (USA-Canada-Mexico)

Price : On request

West Bond 353637E-90 Automatic, Gantry, Large Area, Triple-Convertible Wire Bonder. Currently configured for Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Wafer Size Range Minimum 200 mm Set Size 200 mm Power Requirements 208 V 50.0 A 50/60 Hz Year(s) : 1994 Location : EUROPE (Western and Northern)

Price : On request

Wafer Size Range Set Size 200 mm Power Requirements 208 V 80.0 A 50/60 Hz 3 Phase CE Marked Y Year(s) : 1999 Location : EUROPE (Western and Northern)

Price : On request

MFG by EUNIL Co. 12.5" Magazine Width 110V Specifications ( See Details above for installed options ) Promati Year(s) : 2004 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Vintage : FEB 2011 Details Model: TEX Includes (2) Tray Magazines 220V Specifications ( See Details above fo Year(s) : 2011 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Vintage : MAR 2015 Details Left to Right Board Flow Edge Rail Only Specifications ( See Details above for in Year(s) : 2015 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Flying Probe Tester Year(s) : 2022 Location : ASIA (North East)

Price : On request

insp: Liquid-Particle Counter Location : ASIA (North East)

Price : On request

• Resolution: 3 nm at 30 kV • Magnification: Up to 300,000× • Stage: 5-axis motorized • Sample Size: Supports Year(s) : 2015 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

 Wafer Diameter Maximum 12" (300 mm)  Wafer XY Table Travel (13” x 13”) 334 x 334mm  Die Size (10 x 10 mil Year(s) : 2004 Location : EUROPE (Western and Northern)

Price : On request