Used Semiconductor and PCB Manufacturing
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Still inside crates Year(s) : 2011 Location : EUROPE (Western and Northern)
Price : On request
More detailsProcess: Die Attach Condition: Working Year(s) : 2010 Location : EUROPE (Western and Northern)
Price : On request
More detailsReflow Oven Year(s) : 2003 Location : ASIA (North East)
Price : On request
More detailsReflow Oven Year(s) : 2005 Location : ASIA (North East)
Price : On request
More detailsReflow oven Year(s) : 2008 Location : ASIA (North East)
Price : On request
More detailsInsertion Machine Model MultiSert Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsDie Bonder Model AD 838 Year(s) : 2013 Location : EUROPE (Western and Northern)
Price : On request
More detailsESEC 2100 FC HS Die Bonder De-installed. It should be complete, so they must go by the photos. Year(s) : 2017 Location : EUROPE (Western and Northern)
Price : On request
More details Wafer Diameter Maximum 12" (300 mm) Wafer XY Table Travel (13” x 13”) 334 x 334mm Die Size (10 x 10 mil Year(s) : 2003 Location : EUROPE (Western and Northern)
Price : On request
More detailsChip mounter Year(s) : 2009 Location : ASIA (North East)
Price : On request
More detailsChip mounter Year(s) : 2010 Location : ASIA (North East)
Price : On request
More detailsStepper/6in. Location : ASIA (North East)
Price : On request
More details• Vacuum Units: 1 (second unit optional) • Press Capacity: 60 tons • Stroke Count: 62,133 • Features: Alarm & Year(s) : 2003 Location : EUROPE (Western and Northern)
Price : On request
More details• Equipment Type: Furnace • System Type: Infrared vacuum solder reflow • Pump: Includes turbo pump option • Up Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsWet process machine Location : EUROPE (Western and Northern)
Price : On request
More details• Application: Final-stage polishing of hard materials (sapphire, SiC, GaN) • Down-force: High levels applied Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• Wafer Size: 200 mm • Chuck Type: Temperature controlled (no chiller or controller included) • Microscope: Mi Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsGE Phoenix Micromex 180 KV PCBA X-ray System DOM: 3/2008 180KVA Year(s) : 2008 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• AOI microscope • Load Ports: 2 units of Brooks load port • Version: 300 mm • Sales Condition: As is where is Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsKLA-TENCOR Opti-2600 Thickness Measurement Year(s) : 1995 Location : EUROPE (Western and Northern)
Price : On request
More detailsKLA RS55/TCA Was complete and working condition before de-install Year(s) : 2005 Location : EUROPE (Western and Northern)
Price : On request
More detailsThis is being sold refurbished with a 3 months parts warranty. Its currently configured with SMIF but can be Year(s) : 1999 Location : EUROPE (Western and Northern)
Price : On request
More details• Type: Field Emission SEM with EDX • Version: Laboratory • Sales Condition: As is where is • Lead Time: Immed Year(s) : 2017 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsReflow oven Location : ASIA (North East)
Price : On request
More detailsChip mounter/R to L Year(s) : 2000 Location : ASIA (North East)
Price : On request
More detailsUsed Semiconductor and PCB Manufacturing for sale
You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).
Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.
Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.
This industry is largely located in Asia and expecially in China.
The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES)
The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14