Used Semiconductor and PCB Manufacturing
9,298 resultsFind by category
Automatic Wedge Bonders Condition Good Year of Manufacture 2004 Year(s) : 2004 Location : EUROPE (Western and Northern)
Price : On request
More detailsAutomatic Wedge Bonders Condition Good Year of Manufacture 2010 Year(s) : 2010 Location : EUROPE (Western and Northern)
Price : On request
More detailsTest Equity 1007 Thermal Chamber -73°C to +175°C Temperature Range (opt. to +205°C) 7 Cu Ft Workspace, 24 W x Year(s) : 2012 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsPumis brushline, max panel width 640mm, min panel size 100mm x 100mm, min/ max panel thickness 0.1mm/3,2mm, 40 Year(s) : 2006 Location : EUROPE (Western and Northern)
Price : On request
More detailsfinal product loader. min/max panel 110x55mm/ 500x635mm, min/max panel thickness 0.8mm/4mm Year(s) : 2000 Location : EUROPE (Western and Northern)
Price : On request
More detailsOSP line, 8250mm, direction right to left Year(s) : 2004 Location : EUROPE (Western and Northern)
Price : On request
More detailsAutomatic punching machine for guide hole punching process. Overall machine dimensions (Lx W x H): 1000 x 750 Year(s) : 2007 Location : EUROPE (Western and Northern)
Price : On request
More detailsPicomat, double sided 70 mill grid, max panel size to be tested 325mmx244mm. Year(s) : 1999 Location : EUROPE (Western and Northern)
Price : On request
More detailsTacky roll cleaner Location : EUROPE (Western and Northern)
Price : On request
More details8 spindles, max rpm 125.000 rpm Year(s) : 2001 Location : EUROPE (Western and Northern)
Price : On request
More detailsVertical HASL, lead-free, max panel size 720 x 700mm, 200/ 300 panels per hour, incl. pre-heater & fluxer Year(s) : 2003 Location : EUROPE (Western and Northern)
Price : On request
More detailsdouble sided grid 100 mill, max panel to be tested 244mmx406mm, gridsize can be expanded to max. 488mmx406mm Year(s) : 1998 Location : EUROPE (Western and Northern)
Price : On request
More details-70 TO 200 DEG C, DIGITAL R/O. Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsRecycling system for film developers, the system provides fixer solution cleaning which saves water consumptio Year(s) : 2004 Location : EUROPE (Western and Northern)
Price : On request
More detailsMask aligner up to 6inch wafer Year(s) : 2009 Location : ASIA (North East)
Price : On request
More detailsAutomatic Wedge Bonders Condition Good Year of Manufacture 2006 Year(s) : 2006 Location : EUROPE (Western and Northern)
Price : On request
More detailsAutomatic Wedge Bonders Condition Good Year(s) : 2010 Location : EUROPE (Western and Northern)
Price : On request
More detailsWafer Size 8" Tool's Condition Excellent Capable 4" to 8" Wafer Optical Console - Michelson Interferometer - Year(s) : 1994 Location : ASIA (North East)
Price : On request
More details・Ultra pure water (Milli-Q water): max. 2L/min ・Supply water: Tap water, well water (ion-exchanged water and p Location : ASIA (North East)
Price : On request
More details・Application: Drilling holes of any shape using molds on flexible substrates, film materials such as PET, etc. Year(s) : 2016 Location : ASIA (North East)
Price : On request
More details・Pump: Serial dual piston Flow rate range: 0.001 to 10.0 mL/ min - Pressure range: 0 to 41 MPa (0 to 6000 psi Location : ASIA (North East)
Price : On request
More details• Optical magnification: 0.5x to 7.5x (9.33×7 to 0.622×0.467mm) • Stroke: X axis 300mm × Y axis 200mm × Z axis Location : ASIA (North East)
Price : On request
More details• Observation method: Transmitted light, fluorescent light • Total magnification: 40x, 100x, 200x, 400x, 1000x Location : ASIA (North East)
Price : On request
More detailsAutomatic dosing system for LPI developer. Location : EUROPE (Western and Northern)
Price : On request
More details• Conveyor: Left–Right chain and center support • Heat zones: 3 total (2 pre-heating, 1 peak zone – top/bottom Year(s) : 2011 Location : EUROPE (Western and Northern)
Price : On request
More detailsUsed Semiconductor and PCB Manufacturing for sale
You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).
Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.
Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.
This industry is largely located in Asia and expecially in China.
The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES)
The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14