Used Semiconductor and PCB Manufacturing
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REACTIVE ION ETCHER (RIE) Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsPlasma etcher Capacity: 10 panels Max. panel size: 500 x 610 mm Volume: 3.0 m3, 4 gas chambers. Chamber dimen Year(s) : 1992 Location : EUROPE (Western and Northern)
Price : On request
More detailsSoldering machine Year(s) : 2013 Location : ASIA (North East)
Price : On request
More detailsThis West-Bond 7316C Motorized Scrub Single Collet Eutectic Die Bonder looks to be in good cosmetic conditio Location : EUROPE (Western and Northern)
Price : On request
More detailsThis Mech-El MEI Marpet 1204B Manual Gold Ball Wire Bonder with Ball Bump Option looks to be in good cosmetic Location : EUROPE (Western and Northern)
Price : On request
More detailsType: Dispensing System Model: Millennium Series M600 Asymtek Millennium Series Dispensing System Year(s) : 1998 Location : EUROPE (Western and Northern)
Price : On request
More details300MM ASME 3000 EPI HEX CMD1 Year(s) : 2003 Location : United States (USA)
Price : On request
More detailsHg-CV measurement system Version: up to 12 inch Vintage: 01.01.2004 - Capable up to 12" Wafer - SSM 52 Capac Year(s) : 2004 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsAutomated Photoresist Coater Version: 200 mm Automatic Shut down in Fab. Needs to be removed in the next few Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsMicrowave Downstream Asher--2.4 GHz Accessories Granville Phillips 275 Convectron Gauge Controller Quick Pa Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsDETP2 NITTO SEIKI Co Ltd Fully Automatic Mounter Backside Wafer Taper Year(s) : 2022 Location : United States (USA)
Price : On request
More detailsVintage : AUG 2008 100/115V Kulicke and Soffa ICONN Wire Bonder is a High-performance wire bonding machine. Year(s) : 2008 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsWITH SINGLE FOUP LOADER Year(s) : 2011 Location : United States (USA)
Price : On request
More details3D14 TEL SYNAPSE V BONDER BOND3 300mm Year(s) : 2013 Location : United States (USA)
Price : On request
More detailsDual Head Year(s) : 2014 Location : EUROPE (Western and Northern)
Price : On request
More detailsThis Orthodyne 20R Ultrasonic Ribbon Wire Bonder looks to be in good cosmetic condition, showing some minor Year(s) : 2011 Location : EUROPE (Western and Northern)
Price : On request
More detailsDescription Drying Oven Maximum Temperature 250 ºC (482 ºF, 523 ºK) Heat/Cool Controls Control Type D Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsMaximum Temperature 275 ºC (527 ºF, 548 ºK) Capacity/Volume Box 2.63 cu ft (0.07 cu m) Chamber Size Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsPVA DELTA 6 Selective Coating System In excellent conditions, as new. Technical specifications: X-axis (1 Year(s) : 2019 Location : EUROPE (Western and Northern)
Price : On request
More details200 MHz 2 Analog Channels 8 Digital Channels Location : EUROPE (Western and Northern)
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More details500 MHz 2 Analog Channels 16 Digital Channels Location : EUROPE (Western and Northern)
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More details1 GHz 2 Analog Channels 16 Digital Channels Location : EUROPE (Western and Northern)
Price : On request
More detailsHIGH VACUUM VERSION WITH CTI 8 CRYOPUMP 10-5 TORR INCLUDES REBUILT DIRECT DRIVE VACUUM PUMP BELLOWS CLAMPING S Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details14″ DIAMETER CHAMBER X 16″ LONG (3 GAS CAPABILITY) FOR UP TO 12″ OR 300 MM WAFERS Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details8″ uv flood exposure system, cassette to cassette. Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsUsed Semiconductor and PCB Manufacturing for sale
You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).
Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.
Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.
This industry is largely located in Asia and expecially in China.
The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES)
The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14