Used Semiconductor and PCB Manufacturing
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Mold Press Year of Manufacture 2002 Condition Good Year(s) : 2002 Location : EUROPE (Western and Northern)
Price : On request
More detailsWafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Number of Chambers 3 Process Capabi Year(s) : 2012 Location : EUROPE (Western and Northern)
Price : On request
More detailsMold Press Condition Good Weight 17,637 lb (8,000 kg) Year(s) : 2003 Location : EUROPE (Western and Northern)
Price : On request
More detailsFUSEI MOLD PRESS Accessories One Monitor Year of Manufacture 2015 Condition Good Year(s) : 2015 Location : EUROPE (Western and Northern)
Price : On request
More detailsCURING OVEN Condition Good Year(s) : 2000 Location : EUROPE (Western and Northern)
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More detailsTransferring die from sawn wafer (mounted frame) to die plate or tape and reel. Power Requirements 15.0 Year(s) : 2012 Location : EUROPE (Western and Northern)
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More detailsAccessories Monitors Year of Manufacture 2017 Condition Good Year(s) : 2017 Location : EUROPE (Western and Northern)
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More detailsCondition Good Exterior Dimensions Width 180.000 in (457.2 cm) Depth 68.000 in (172.7 cm) Heigh Year(s) : 1995 Location : EUROPE (Western and Northern)
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More detailsWafer Size Range Minimum 150 mm Maximum 200 mm Set Size 150 mm Number of Cassette Platforms 24 Rob Location : EUROPE (Western and Northern)
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More detailsDie level inspection on tape & reel and waffle plate. Manufacturer Exclusive Master Power Requirements 230 V Year(s) : 2016 Location : EUROPE (Western and Northern)
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More detailsAccessories Monitors Year of Manufacture 2016 Condition Good Year(s) : 2016 Location : EUROPE (Western and Northern)
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More detailsAccessories Monitors Year of Manufacture 2018 Condition Good Year(s) : 2018 Location : EUROPE (Western and Northern)
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More detailsAccessories Monitors Year of Manufacture 2017 Condition Good Year(s) : 2017 Location : EUROPE (Western and Northern)
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More detailsAccessories Monitors Year of Manufacture 2016 Condition Good Year(s) : 2016 Location : EUROPE (Western and Northern)
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More detailsIncluded 3 monitors Condition Good Year(s) : 2004 Location : EUROPE (Western and Northern)
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More detailsDESPATCH CURING OVEN Condition Good Year(s) : 2018 Location : EUROPE (Western and Northern)
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More detailsTransferring die from sawn wafer (mounted frame) to tape and reel. Power Requirements 115 V 12.5 A Year o Year(s) : 1998 Location : EUROPE (Western and Northern)
Price : On request
More detailsDESPATCH CURING OVEN Year of Manufacture 2016 Condition Good Year(s) : 2016 Location : EUROPE (Western and Northern)
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More detailsAccessories 3 monitors Condition Good Year of Manufacture 2008 Year(s) : 2008 Location : EUROPE (Western and Northern)
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More detailsAccessories Monitors Year of Manufacture 2019 Condition Good Year(s) : 2019 Location : EUROPE (Western and Northern)
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More detailsWIRE BONDER Accessories Monitors Year of Manufacture 2003 Condition Good Year(s) : 2003 Location : EUROPE (Western and Northern)
Price : On request
More detailsCondition Good Year(s) : 2004 Location : EUROPE (Western and Northern)
Price : On request
More detailsWafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Robot Manufacturer/Model Genmark C Year(s) : 1999 Location : EUROPE (Western and Northern)
Price : On request
More detailsCURING OVEN Condition Good Year(s) : 2010 Location : EUROPE (Western and Northern)
Price : On request
More detailsCondition Good Exterior Dimensions Width 106.299 in (270.0 cm) Depth 62.992 in (160.0 cm) Heigh Year(s) : 2011 Location : EUROPE (Western and Northern)
Price : On request
More detailsUsed Semiconductor and PCB Manufacturing for sale
You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).
Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.
Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.
This industry is largely located in Asia and expecially in China.
The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES)
The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14