Used Semiconductor and PCB Manufacturing
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Condition Good Year(s) : 2010 Location : EUROPE (Western and Northern)
Price : On request
More detailsLASER MARK KINERGY TAPING ARRAY CUT LPC01 Condition Good Year of Manufacture 2015 Year(s) : 2015 Location : EUROPE (Western and Northern)
Price : On request
More detailsCondition Good Year of Manufacture 2009 Year(s) : 2009 Location : EUROPE (Western and Northern)
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More detailsCondition Good Power Requirements 380 V 3 Phase Power Consumption 17 Kw 58 BTU/Hour. Exterior Dimension Year(s) : 1998 Location : EUROPE (Western and Northern)
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More detailsDA_TOSOK DBD4600_TG89 Condition Good Year of Manufacture 2014 Year(s) : 2014 Location : EUROPE (Western and Northern)
Price : On request
More detailsMaximum Temperature 350 ºC (662 ºF, 623 ºK) Year of Manufacture 2015 Condition Good Year(s) : 2015 Location : EUROPE (Western and Northern)
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More detailsCondition Good Power Requirements 380 V 3 Phase Power consumption 17 Kw 58 BTU/Hour. Exterior Dimension Year(s) : 2000 Location : EUROPE (Western and Northern)
Price : On request
More detailsNumber of Test Heads 2 Year of Manufacture 1998 Condition Fair Year(s) : 1998 Location : EUROPE (Western and Northern)
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More detailsAutomatic Epoxy Die Bonders Condition Good Year(s) : 2011 Location : EUROPE (Western and Northern)
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More detailsManufacturer ACA Integration Model AQN2D2 Description EAV_ACA AQN2D2_EAV003 Year of Manufacture 2020 Condi Year(s) : 2020 Location : EUROPE (Western and Northern)
Price : On request
More detailsAutomatic Epoxy Die Bonders Condition Good Year(s) : 2015 Location : EUROPE (Western and Northern)
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More detailsWafer Size Range Minimum 300 mm Missing parts: No harddisk at stepper workstation installed. No printed ma Year(s) : 2001 Location : EUROPE (Western and Northern)
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More detailsWafer Size Range Set Size 200 mm Power Requirements 208 V 80.0 A 50/60 Hz 3 Phase CE Marked Y Year(s) : 1999 Location : EUROPE (Western and Northern)
Price : On request
More detailsCanon FPA- 5500iZ+ Wafer Size Range Minimum 300 mm Maximum 300 mm Set Size 300 mm Other Information Year(s) : 2004 Location : EUROPE (Western and Northern)
Price : On request
More detailsGeneral Configuration: FPA 3000 - i5(+) Manufactured in June / 1997 8“ Wafer Chuck, Notch PA unit 6“ Nikon-ty Year(s) : 1997 Location : EUROPE (Western and Northern)
Price : On request
More detailsF30 Inspectiontool Power Requirements 200-240 V 10.0 A 50/60 Hz CE Marked YES Condition Fair Year(s) : 2011 Location : EUROPE (Western and Northern)
Price : On request
More detailsCURING OVEN Condition Good Year(s) : 2010 Location : EUROPE (Western and Northern)
Price : On request
More detailsWidth 70.866 in (180.0 cm) Depth 26.772 in (68.0 cm) Height 86.614 in (220.0 cm) Weight 22,046 Year(s) : 1996 Location : EUROPE (Western and Northern)
Price : On request
More details- Wafer Size Range: 200 mm - Condition: Good - Manufacturing Date: 2004 - Width: 354.0 cm (139.37 in) Year(s) : 2004 Location : EUROPE (Western and Northern)
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More detailsAccessories Monitors Year of Manufacture 2018 Condition Good Year(s) : 2018 Location : EUROPE (Western and Northern)
Price : On request
More detailsMOLD PRESS Year of Manufacture 2006 Condition Good Year(s) : 2006 Location : EUROPE (Western and Northern)
Price : On request
More detailsFINMAC DEFLASH Year of Manufacture 1994 Condition Good Location : EUROPE (Western and Northern)
Price : On request
More detailsAccessories Monitors Condition Good Year of Manufacture 2018 Year(s) : 2018 Location : EUROPE (Western and Northern)
Price : On request
More detailsMOLD PRESS Accessories One Monitor Year of Manufacture 2002 Condition Good Year(s) : 2002 Location : EUROPE (Western and Northern)
Price : On request
More detailsAccessories Monitors Condition Good Year of Manufacture 2017 Year(s) : 2017 Location : EUROPE (Western and Northern)
Price : On request
More detailsUsed Semiconductor and PCB Manufacturing for sale
You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).
Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.
Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.
This industry is largely located in Asia and expecially in China.
The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES)
The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14