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Used Semiconductor and PCB Manufacturing

9,133 results
1

Wafer Mount Accessories Includes one monitor Condition Good Year(s) : 2005 Location : EUROPE (Western and Northern)

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Power Requirements 240 V 13.0 A Condition Excellent Year(s) : 2014 Location : EUROPE (Western and Northern)

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Accessories Monitors Year of Manufacture 2006 Condition Good Year(s) : 2006 Location : EUROPE (Western and Northern)

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Condition Good Year of Manufacture 2010 Year(s) : 2010 Location : EUROPE (Western and Northern)

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ESEC Die Bonder Accessories - Monitors Condition Good Year of Manufacture 2004 Year(s) : 2004 Location : EUROPE (Western and Northern)

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MidCurrent Implanter Condition Good Year of Manufacture 2002 Power Requirements 208 V CE Marked YES Year(s) : 2002 Location : EUROPE (Western and Northern)

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Wafer Size Range Minimum 150 mm Maximum 300 mm Set Size 300 mm Number of Robots 1 Position 1 Tank M Year(s) : 2016 Location : EUROPE (Western and Northern)

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TWS-M3111 Software Version TWS-M3111 Electric Schematic Number 81152323 Condition Very Good Power Requirement Year(s) : 2011 Location : EUROPE (Western and Northern)

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Plasma Etch Wafer Size Range Minimum 150 mm Maximum 150 mm Set Size 150 mm Other Information proc Year(s) : 1995 Location : EUROPE (Western and Northern)

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Accessories 3 monitors Condition Good Year of Manufacture 2011 Year(s) : 2011 Location : EUROPE (Western and Northern)

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ESEC Die Bonder Accessories Monitors Condition Good Year of Manufacture 2001 Year(s) : 2001 Location : EUROPE (Western and Northern)

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Plasma Etch Wafer Size Range Minimum 150 mm Maximum 150 mm Set Size 150 mm Other Information proc Year(s) : 1995 Location : EUROPE (Western and Northern)

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Accessories Monitors Condition Good Year of Manufacture 2010 Year(s) : 2010 Location : EUROPE (Western and Northern)

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Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 150 mm Robot Manufacturer/Model Genmark C Year(s) : 1996 Location : EUROPE (Western and Northern)

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P5000 17 Main Frame Only Condition Very Good Year(s) : 2007 Location : EUROPE (Western and Northern)

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Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Controller Type PC Controller Type Year(s) : 1995 Location : EUROPE (Western and Northern)

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Mounter Wafer Size Range Set Size 200 mm Condition Good Year(s) : 1996 Location : EUROPE (Western and Northern)

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Defolieranlage Condition Very Good Power Requirements Other V 50 Hz 3 Phase Year(s) : 2011 Location : EUROPE (Western and Northern)

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InkJet Printer Accessories no Condition Like New Year of Manufacture 2021 Power Requirements 380 V 7.0 Year(s) : 2021 Location : EUROPE (Western and Northern)

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Atomic Force Microscope (AFM) Wafer Size Range Minimum 200 mm Maximum 300 mm Set Size 300 mm Power Requir Year(s) : 2004 Location : EUROPE (Western and Northern)

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De-foiling system Wafer Size Range Set Size 150 mm Condition Good Power Requirements 230 V 50.0 A Year(s) : 2007 Location : EUROPE (Western and Northern)

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Microscope Accessories without x - y table Power Requirements 200-240 V 2.0 A 50/60 Hz Condition Go Year(s) : 1997 Location : EUROPE (Western and Northern)

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WSS Glass Demount Wafer Size Range Set Size 200 mm Condition Very Good Year(s) : 2014 Location : EUROPE (Western and Northern)

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Condition Good Power Requirements 220 V 24.0 A 15.0 A(2) 50 Hz 3 Phase Year(s) : 2008 Location : EUROPE (Western and Northern)

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WAFER SPECIFICATION Wafer Size 150mm SYSTEM CONFIGURATION CHAMBER A CHAMBER B Year(s) : 2007 Location : EUROPE (Western and Northern)

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Used Semiconductor and PCB Manufacturing for sale

You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).

Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.

Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.

This industry is largely located in Asia and expecially in China.

The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES) 

The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14

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