Used Bonder
460 resultsRotary Bonder Model 360B Year(s) : 2002 Location : EUROPE (Western and Northern)
Price : On request
More detailsDage 2400A sold in working condition Wire Pull and Ball Shear Modules availabe Location : EUROPE (Western and Northern)
Price : On request
More detailsDie Bonder (3 Sets) Wafer Size 200mm Location : EUROPE (Western and Northern)
Price : On request
More detailsOur services include individual configuration, complete installation, and training upon request. Fast delivery Year(s) : 2003 Location : EUROPE (Western and Northern)
Price : On request
More details- Heavy wire, HBK07-0020, back cut - e-box Location : EUROPE (Western and Northern)
Price : On request
More details3100plus and 3100 Optima units have been refurbished according to the manufacturer's specifications Location : EUROPE (Western and Northern)
Price : On request
More detailsHeavy Wire Bonder like new. Modifications possible upon request. Location : EUROPE (Western and Northern)
Price : On request
More detailsLike New Including Heated work Holder Year(s) : 2023 Location : EUROPE (Western and Northern)
Price : On request
More detailsWedge-wedge, Bondhead 60° e-box Year(s) : 2019 Location : EUROPE (Western and Northern)
Price : On request
More detailsGOCu-Ball Bonder Year(s) : 2016 Location : EUROPE (Western and Northern)
Price : On request
More detailsCU kit Copper Bonder Year(s) : 2016 Location : EUROPE (Western and Northern)
Price : On request
More detailsWedge-wedge, Bondhead 60° e-box Vers. 2 Year(s) : 2014 Location : EUROPE (Western and Northern)
Price : On request
More detailsComplete and in working condition Year(s) : 2011 Location : EUROPE (Western and Northern)
Price : On request
More detailsIn excellent condition Year(s) : 2010 Location : EUROPE (Western and Northern)
Price : On request
More detailsASM Wafer Die Sorter MS899-DL Model Number: MS899-DL Year: August 2008 Cycle Time: 175ms XY Placement: +/- 1. Year(s) : 2008 Location : EUROPE (Western and Northern)
Price : On request
More detailsFlip Chip Bonder Maker BESI Year(s) : 2022 Location : South Korea
Price : On request
More detailsFli: Micro bonder/8in Location : South Korea
Price : On request
More detailsFlip Chip Bonder Year(s) : 2007 Location : South Korea
Price : On request
More details2200 EVO (Gen1) Bonder Year(s) : 2011 Location : EUROPE (Western and Northern)
Price : On request
More details2200 EVO (Gen2) Bonder Year(s) : 2014 Location : EUROPE (Western and Northern)
Price : On request
More details2200 EVO+ Bonder Year(s) : 2019 Location : EUROPE (Western and Northern)
Price : On request
More details2200 EVO Bonder Year(s) : 2018 Location : EUROPE (Western and Northern)
Price : On request
More detailsFeatures: • Wafer Capacity: up to 12 inch (300 mm) wafers or film frames • Pneumatic Ram: speed controlled • R Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsWire Bonder Year(s) : 2021 Location : South Korea
Price : On request
More detailsFli: Micro bonder/8in Location : South Korea
Price : On request
More detailsYou can find used Bonder on Wotol
The main manufacturers of Bonder are Esec, ASM, West Bond, K & S, Kulicke and Soffa (K&S), EVG, Orthodyne, KNS, Westbond, Alphasem, Dage, Delvotec, Mech-El, Hesse, Alessi , Benchmark, Cedal, CMI (Coating Measuring Industries), Datacon, Disco, DNS Dpveen, Dynatex, Ewald Instruments,F&K Delvotec, Hesse & Knipps,Hesse, Hughes, Hybond, HyperVision, Karl Suss, Kulicke and Soffa (K&S) , Laurier, Logitech, MBS, MEI, MRSI, Mullen, OAI, Optima, Palomar, Pesl, Research Device Automation, Research Devices, Royce, SEC, Semiconductor Equipment Corporation (SEC), Shinkawa, Suss, TEL, Tosok, TPT, Tresky, Ultron , Unitek .
The main model 2008HS3 Plus, Eagle Express GOCu , DieSeries, 2100 hS, T-3000-FC3 , Delvotec 5610, Royce 550 Die Bonder, 1204W, A7372E, 7374B, 4523, 1204W, 827, 907Series, 1204B, 829Z, 909Series, 20 Wedge, AD896-06, 2200 EVO, Eagle 60, 2200 APM, 5400B, 7400, 7416, 3100, DINP, 3100, Delvotec, Wedge, LAW-820, DBD3550R, UTC1000, M360C, 850TB,7200A, 520, BT, 572-40, DXB, 505Series, SA220, 4000, 572A, 522, 552A 3000, 703, 709/703, 1WBT5, 850Series, 8000, 3088, 2006S, 3018, 4000HS, CP-222, Swissline, 4020Series, 4450, 7200c, 703/709, 454630E-79, 7400B HBSeries OE, 4000, 360C, 20, 6320, 1WBS2, 990, 20R, 2400PC, 7400A, AD809S Series-4000-P, BJ920 M360C, 8000, UH130, 2200, 2100XP, Leadfrme, 3200, 2100FC, 2008, HS3PLUS, 3088CU, AB339, AD898, 898, 2470-V.
HS Code 8486 90 00 for Die Bonder Machine - Parts and Accessories and other machinery from 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays