Used Bonder
353 results7 sets ASM Harrier Bonders Vintage 2009~2010 Working condition Year(s) : 2009, 2010 Location : EUROPE (Western and Northern)
Price : On request
More detailsThis West-Bond 545657B is a Semi-Automatic Three-Way Convertible 45° Wire Feed Wedge, 90° Wire & Ribbon Feed Location : EUROPE (Western and Northern)
Price : On request
More detailsDie Bonder Model AD809M-06 Year(s) : 2002 Location : EUROPE (Western and Northern)
Price : On request
More detailsProvides the High Yields and Excellent Repeatability Needed for All Gold Ball Bonding Applications Including: Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsIncludes: FINEPLACER lambda Bonding force module FD3 Chip heating module Optional Dispensing Module FG3 WinFli Year(s) : 2017 Location : EUROPE (Western and Northern)
Price : On request
More detailsThis West-Bond 7372E Convertible Epoxy / Eutectic Die Bonder looks to be in good cosmetic condition, showing Location : EUROPE (Western and Northern)
Price : On request
More detailsASM AD898 die bonder, 2 sets ASM AD898 for sale Ex works China , both vintage 2006, Can Trial Run. Year(s) : 2002 Location : EUROPE (Western and Northern)
Price : On request
More detailsNikon Eclipse L200D Nomarski 8" Wafer Inspection Microscope with Camera and Measuring Software. Includes a S Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsK&S 4524D Programmable Digital Ball Bonder. Manages 200 programs with up to six channels per program. Digita Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsWest Bond 353637E-90 Automatic, Gantry, Large Area, Triple-Convertible Wire Bonder. Currently configured for Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details Wafer Diameter Maximum 12" (300 mm) Wafer XY Table Travel (13” x 13”) 334 x 334mm Die Size (10 x 10 mil Year(s) : 2004 Location : EUROPE (Western and Northern)
Price : On request
More detailsStill inside crates Year(s) : 2011 Location : EUROPE (Western and Northern)
Price : On request
More detailsProcess: Die Attach Condition: Working Year(s) : 2010 Location : EUROPE (Western and Northern)
Price : On request
More detailsDie Bonder Model AD 838 Year(s) : 2013 Location : EUROPE (Western and Northern)
Price : On request
More detailsESEC 2100 FC HS Die Bonder De-installed. It should be complete, so they must go by the photos. Year(s) : 2017 Location : EUROPE (Western and Northern)
Price : On request
More details Wafer Diameter Maximum 12" (300 mm) Wafer XY Table Travel (13” x 13”) 334 x 334mm Die Size (10 x 10 mil Year(s) : 2003 Location : EUROPE (Western and Northern)
Price : On request
More detailsvertical feed ultrasonic wedge bonder. Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• Type: Wire Bonder • Bonding Type: Ball bonder • Optics: Includes stereo zoom optics • Optics Option: Upgrade Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• Type: Wire Bonder • Feed Type: Vertical feed • Options: Heated work holders available • Options: Heated tran Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• Type: Semi-Automatic Wire Bonder • Design: Gantry, above work plane • Bonding Modes: Wedge-Wedge, Ball-Wedge Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• Equipment type: Prober • Condition: Refurbished Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• Type: Epoxy die bonder • Display: LCD • Optics: Stereo zoom optics • Function: Epoxy dispense • Function: Ro Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsSold in working condition Vintages 2009~2013 Year(s) : 2009, 2013 Location : EUROPE (Western and Northern)
Price : On request
More detailsDouble Cabin Machine type one Controller. Year(s) : 2005 Location : EUROPE (Western and Northern)
Price : On request
More detailsWire bonder Vintage : 2006/7 units,2005/4 units Condition : Off line Year(s) : 2005, 2006 Location : EUROPE (Western and Northern)
Price : On request
More detailsYou can find used Bonder on Wotol
The main manufacturers of Bonder are Esec, ASM, West Bond, K & S, Kulicke and Soffa (K&S), EVG, Orthodyne, KNS, Westbond, Alphasem, Dage, Delvotec, Mech-El, Hesse, Alessi , Benchmark, Cedal, CMI (Coating Measuring Industries), Datacon, Disco, DNS Dpveen, Dynatex, Ewald Instruments,F&K Delvotec, Hesse & Knipps,Hesse, Hughes, Hybond, HyperVision, Karl Suss, Kulicke and Soffa (K&S) , Laurier, Logitech, MBS, MEI, MRSI, Mullen, OAI, Optima, Palomar, Pesl, Research Device Automation, Research Devices, Royce, SEC, Semiconductor Equipment Corporation (SEC), Shinkawa, Suss, TEL, Tosok, TPT, Tresky, Ultron , Unitek .
The main model 2008HS3 Plus, Eagle Express GOCu , DieSeries, 2100 hS, T-3000-FC3 , Delvotec 5610, Royce 550 Die Bonder, 1204W, A7372E, 7374B, 4523, 1204W, 827, 907Series, 1204B, 829Z, 909Series, 20 Wedge, AD896-06, 2200 EVO, Eagle 60, 2200 APM, 5400B, 7400, 7416, 3100, DINP, 3100, Delvotec, Wedge, LAW-820, DBD3550R, UTC1000, M360C, 850TB,7200A, 520, BT, 572-40, DXB, 505Series, SA220, 4000, 572A, 522, 552A 3000, 703, 709/703, 1WBT5, 850Series, 8000, 3088, 2006S, 3018, 4000HS, CP-222, Swissline, 4020Series, 4450, 7200c, 703/709, 454630E-79, 7400B HBSeries OE, 4000, 360C, 20, 6320, 1WBS2, 990, 20R, 2400PC, 7400A, AD809S Series-4000-P, BJ920 M360C, 8000, UH130, 2200, 2100XP, Leadfrme, 3200, 2100FC, 2008, HS3PLUS, 3088CU, AB339, AD898, 898, 2470-V.
HS Code 8486 90 00 for Die Bonder Machine - Parts and Accessories and other machinery from 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays