KLA-Tencor Candela CS10V Optical Defect Inspection
ASIA (North East)
The Candela CS10 Optical Surface Analyzer offers a new approach to unpatterned wafer surface defect detection. By combining two laser paths and four independent wafer surface defect detection techniques, the CS10 Optical Surface Analyzer offers exceptional sensitivity to particles and scratches on optoelectronics and semiconductor wafers.
Dual-laser Optical X-Beam surface defect analyzer technology is well-suited for both laboratory and low volume production applications.
For both laboratory and low volume production applications (Manual Load type)
[ General Description ]
Wafer Size : 2 ~8 inch (Currently 6" stage configured)
Illumination Source : 25 mW laser, 405 nm wavelength
Operator Interface : Trackball and keyboard standard
Substrate Thickness : 350 μm –;; 1,100 μm
Substrate Material : Any clear or opaque polished surface
[ Performance ]
Defect Sensitivity 0.08 μm diameter PSL sphere equivalent > 95% capture rate(PSL on bare Si)
Other Defects and Applications : Particles, scratches, stains, pits, and bumps.
Sensitivity: Minimum detectable size for automatic defect classification:
•;; Scratches: 100 μm long, 0.1 μm wide, 50 Å;; deep.
•;; Pits: 20 μm diameter, 50 Å;; deep
•;; Stains: 20 μm diameter, 10 Å;; thick
[ Application ]
-. Opaque substrates
-. EPI Layers
-. Transparent film coatings (SiC, GaN, Sapphire)
[ Physical Dimension ]
- W*D*H :56*107*178 cm / - Weight Instrument: 337 kg