KLA-Tencor Spectra Film LD10

Wafer Size 300 mm
Fab Section Metrology

General Product Information
Vendor Supplier COMPLAIN
Model Spectra Film LD10
Asset Description Spectroscopic Thickness Tool
Software Version 6.20.34.11002
CIM SECS
Process Metrology

Hardware Configuration (Fab)
Main System iDesorber 1
Main System Single Wavelength Ellipsometry OK
Main System Stress Measurement 1 OK
Main System Broadband Spectroscopic Ellipsometry 1 OK
Main System Wafer Thickness (BOW) 1
Main System UltraViolet Reflectometry OK
Handler System Phoenix EFEM 2 1 OK
Main System White Light Reflectometry OK
Factory Interface FOUP 3